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1. WO2013137130 - SEALANT PASTE AND SEALING METHOD

Publication Number WO/2013/137130
Publication Date 19.09.2013
International Application No. PCT/JP2013/056424
International Filing Date 08.03.2013
IPC
C08L 77/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
77Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
C08G 69/02 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
69Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
02Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids
H01L 21/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56Encapsulations, e.g. encapsulating layers, coatings
H01L 23/29 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
H01L 23/31 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
CPC
C08G 69/36
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
69Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
02Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
36derived from amino acids, polyamines and polycarboxylic acids
C08L 77/02
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
77Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain
02Polyamides derived from omega-amino carboxylic acids or from lactams thereof
C08L 77/06
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
77Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain
06Polyamides derived from polyamines and polycarboxylic acids
C09J 177/06
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
177Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain
06Polyamides derived from polyamines and polycarboxylic acids
C09K 3/1006
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
3Materials not provided for elsewhere
10Materials in mouldable or extrudable form; for sealing or packing joints or covers
1006characterised by the chemical nature of one of its constituents
H01L 23/293
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
29characterised by the material ; , e.g. carbon
293Organic, e.g. plastic
Applicants
  • ダイセル・エボニック株式会社 DAICEL-EVONIK LTD. [JP]/[JP]
Inventors
  • 有田 博昭 ARITA Hiroaki
  • 中家 芳樹 NAKAIE Yoshiki
  • 六田 充輝 MUTSUDA Mitsuteru
Agents
  • 鍬田 充生 KUWATA Mitsuo
Priority Data
2012-05997016.03.2012JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SEALANT PASTE AND SEALING METHOD
(FR) AGENT D'ÉTANCHÉITÉ SOUS FORME DE PÂTE, ET PROCÉDÉ D'ÉTANCHÉIFICATION
(JA) ペースト状封止剤及び封止方法
Abstract
(EN)
Provided are a sealant paste and a sealing method whereby it is possible to shorten the sealing/forming cycle even when an aqueous medium is used. The sealant paste is for molding and sealing a device, and contains a copolymer polyamide resin and an aqueous medium. The copolymer polyamide resin may be crystalline, and the melting point or softening point of the copolymer polyamide resin may be 75-160° C. The copolymer polyamide resin may be a multi-component copolymer, e.g., a binary copolymer or a ternary copolymer. In addition, the copolymer polyamide resin may contain a unit derived from a long-chain component (at least one component selected from among C9-17 lactam and amino C9-17 alkane carboxylic acid) that has a C8-16 alkylene group. The sealant paste may additionally contain a thickening agent (for example, a (meth)acrylic acid polymer).
(FR)
L'invention fournit un agent d'étanchéité sous forme de pâte, un et procédé d'étanchéification permettant de réduire un cycle étanchéification / moulage, même lorsqu'un milieu aqueux est mis en œuvre. L'agent d'étanchéité sous forme de pâte destiné au moulage et à l'étanchéification d'un dispositif, contient une résine polyamide de copolymère et un milieu aqueux. La résine polyamide de copolymère peut présenter des propriétés cristallines, et son point de fusion ou de ramollissement peut se situer entre 75 et 160°C. La résine polyamide de copolymère peut consister en un copolymère à plusieurs composés, par exemple en un copolymère binaire ou ternaire. En outre, la résine polyamide de copolymère peut contenir une unité dérivée d'un composant à longue chaîne possédant un groupe C8-16 alkylène (au moins une sorte de composant choisi parmi une C9-17 lactame et un amino C9-17 alcane carboxylique). L'agent d'étanchéité sous forme de pâte peut contenir aussi un épaississant (par exemple, un polymère de type acide (méth)acrylique).
(JA)
 水性媒体を用いても封止・成形サイクルを短縮できるペースト状封止剤及び封止方法を提供する。 デバイスをモールドして封止するためのペースト状封止剤は、共重合ポリアミド系樹脂と水性媒体とを含んでいる。共重合ポリアミド系樹脂は結晶性を有していてもよく、共重合ポリアミド系樹脂の融点又は軟化点は75~160℃であってもよい。共重合ポリアミド系樹脂は、多元共重合体、例えば、二元又は三元共重合体であってもよい。さらに、共重合ポリアミド系樹脂は、C8-16アルキレン基を有する長鎖成分(C9-17ラクタム及びアミノC9-17アルカンカルボン酸から選択された少なくとも一種の成分)に由来する単位を含んでいてもよい。ペースト状封止剤は、さらに増粘剤[例えば、(メタ)アクリル酸系重合体]を含んでいてもよい。
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