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1. (WO2013126308) HIGH CURRENT, LOW EQUIVALENT SERIES RESISTANCE PRINTED CIRCUIT BOARD COIL FOR POWER TRANSFER APPLICATION
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/126308 International Application No.: PCT/US2013/026601
Publication Date: 29.08.2013 International Filing Date: 18.02.2013
IPC:
H01F 17/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
F
MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
17
Fixed inductances of the signal type
Applicants: HUAWEI TECHNOLOGIES CO., LTD.[CN/CN]; Huawei Administration Building Bantian Longgang District Shenzhen, Guangdong 518129, CN
FUTUREWEI TECHNOLOGIES, INC.[US/US]; US (US)
Inventors: ZABACO, Jorge; US
Agent: CONLEY, Rose, P.C.; 5601 Granite Parkway Suite 750 Plano , Texas 75024, US
Priority Data:
13/535,05927.06.2012US
61/600,96920.02.2012US
Title (EN) HIGH CURRENT, LOW EQUIVALENT SERIES RESISTANCE PRINTED CIRCUIT BOARD COIL FOR POWER TRANSFER APPLICATION
(FR) BOBINE SUR CARTE DE CIRCUIT IMPRIMÉ À RÉSISTANCE SÉRIE ÉQUIVALENTE FAIBLE ET FORT COURANT POUR APPLICATION DE TRANSMISSION DE PUISSANCE
Abstract:
(EN) A method for fabricating an electric coil on a circuit board comprising fabricating on the circuit board a first coil layer comprising a coil trace and a plurality of vias distributed along the length of the coil trace, and overlaying a second coil layer on the first coil layer, wherein the vias of the first coil layer join the first coil layer and the second coil layer..
(FR) L'invention concerne un procédé de fabrication d'une bobine électrique sur une carte de circuit imprimé comprenant les étapes consistant à fabriquer sur la carte de circuit imprimé une première couche de bobine comprenant un tracé de bobine et une pluralité de trous d'interconnexion répartis sur la longueur du tracé de bobine, et à superposer une seconde couche de bobine sur la première couche de bobine. Les trous d'interconnexion de la première couche de bobine joignent la première couche de bobine et la seconde couche de bobine.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)