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1. (WO2013125563) POLYCARBONATE RESIN COMPOSITION CONTAINING DISPERSED COMPOSITE-TUNGSTEN-OXIDE MICROPARTICLES AND RADIATED-HEAT-BLOCKING MOLDED BODY AND RADIATED-HEAT-BLOCKING LAMINATE USING SAID COMPOSITION
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/125563 International Application No.: PCT/JP2013/054135
Publication Date: 29.08.2013 International Filing Date: 20.02.2013
IPC:
C08L 69/00 (2006.01) ,B32B 27/20 (2006.01) ,B32B 27/36 (2006.01) ,C08K 3/22 (2006.01) ,C08K 3/24 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
69
Compositions of polycarbonates; Compositions of derivatives of polycarbonates
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
18
characterised by the use of special additives
20
using fillers, pigments, thixotroping agents
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
36
comprising polyesters
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
18
Oxygen-containing compounds, e.g. metal carbonyls
20
Oxides; Hydroxides
22
of metals
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
18
Oxygen-containing compounds, e.g. metal carbonyls
24
Acids; Salts thereof
Applicants:
住友金属鉱山株式会社 SUMITOMO METAL MINING CO., LTD. [JP/JP]; 東京都港区新橋五丁目11番3号 11-3, Shimbashi 5-chome, Minato-ku Tokyo 1058716, JP
Inventors:
見良津 三信 MIRATSU Mitsunobu; JP
藤田 賢一 FUJITA Kenichi; JP
Agent:
阿仁屋 節雄 ANIYA Setuo; 東京都千代田区飯田橋四丁目6番1号 21東和ビル3階 21 TOWA Bldg 3F, 6-1, Iidabashi 4-chome, Chiyoda-ku, Tokyo 1020072, JP
Priority Data:
2012-03585622.02.2012JP
Title (EN) POLYCARBONATE RESIN COMPOSITION CONTAINING DISPERSED COMPOSITE-TUNGSTEN-OXIDE MICROPARTICLES AND RADIATED-HEAT-BLOCKING MOLDED BODY AND RADIATED-HEAT-BLOCKING LAMINATE USING SAID COMPOSITION
(FR) COMPOSITION DE RÉSINE DE POLYCARBONATE CONTENANT DES MICROPARTICULES DISPERSÉES D'OXYDE DE TUNGSTÈNE-COMPOSITE ET CORPS MOULÉ BLOQUANT LA CHALEUR RAYONNÉE ET STRATIFIÉ BLOQUANT LA CHALEUR RAYONNÉE UTILISANT LADITE COMPOSITION
(JA) 複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物およびそれを用いた熱線遮蔽成形体並びに熱線遮蔽積層体
Abstract:
(EN) Provided is a polycarbonate resin composition in which composite-tungsten-oxide microparticles are dispersed. Said resin composition, which contains composite-tungsten-oxide microparticles represented by the general formula MxWyOz, a metal salt, and a polycarbonate resin, is characterized in that said metal salt consists of salts of one or more metals selected from among magnesium, nickel, zinc, indium, and tin.
(FR) L'invention concerne une composition de résine de polycarbonate dans laquelle des microparticules d'oxyde de tungstène-composite sont dispersées. Ladite composition de résine, qui contient des microparticules d'oxyde de tungstène-composite représentées par la formule générale MxWyOz, un sel de métal et une résine de polycarbonate, est caractérisée en ce que ledit sel de métal consiste en sels d'un ou de plusieurs métaux sélectionnés parmi le magnésium, le nickel, le zinc, l'indium et l'étain.
(JA)  一般式MxWyOzで表される複合タングステン酸化物微粒子と、金属塩と、ポリカーボネート樹脂とを含む樹脂組成物であって、当該金属塩が、Mg、Ni、Zn、In、Snの内から選択される1種類以上の金属元素の塩であることを特徴とする複合タングステン酸化物微粒子分散ポリカーボネート樹脂組成物を提供する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)