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1. (WO2013125267) METHOD FOR SEPARATING A SUPPORT BODY AND DEVICE FOR SEPARATING A SUPPORT BODY

Pub. No.:    WO/2013/125267    International Application No.:    PCT/JP2013/050823
Publication Date: Fri Aug 30 01:59:59 CEST 2013 International Filing Date: Fri Jan 18 00:59:59 CET 2013
IPC: H01L 21/02
H01L 21/304
Applicants: TOKYO OHKA KOGYO CO., LTD.
東京応化工業株式会社
Inventors: FUJII, Yasushi
藤井 恭
TAKASE, Shinji
高瀬 真治
Title: METHOD FOR SEPARATING A SUPPORT BODY AND DEVICE FOR SEPARATING A SUPPORT BODY
Abstract:
A method for separating a support body wherein a laminated body (1), formed by laminating, in order, a substrate (11), an adhesive layer (14), a separation layer (16) which transforms upon absorption of light, and a support plate (12), is separated, which method comprises an irradiation step wherein laser light which has been pulse oscillated at a pulse width of 20 nanoseconds or more is irradiated onto the separation layer (16).