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1. (WO2013124356) METHOD FOR CARRYING OUT SOLDER CONNECTIONS IN A TECHNOLOGICALLY OPTIMIZED MANNER

Pub. No.:    WO/2013/124356    International Application No.:    PCT/EP2013/053458
Publication Date: Fri Aug 30 01:59:59 CEST 2013 International Filing Date: Fri Feb 22 00:59:59 CET 2013
IPC: B23K 1/00
B23K 1/19
H01R 43/02
H01R 4/02
Applicants: FEW FAHRZEUGELEKTRIKWERK GMBH & CO. KG
Inventors: JENRICH, Andrè
Title: METHOD FOR CARRYING OUT SOLDER CONNECTIONS IN A TECHNOLOGICALLY OPTIMIZED MANNER
Abstract:
The invention relates to a method for carrying out solder connections in a technologically optimized manner, in particular lead-free solder connections. At least one of the joining partners provides the solder required for the connection. A flux is used in order to activate the solder, and the electric and mechanical connection is carried out by means of a soldering process under the effect of heat and by melting the solder/flux mixture with the inclusion of a subsequent cooling phase. According to the invention, the joining partners and the solder are heated to a temperature below the activation temperature of the solder and the flux in a first temperature treatment phase. Another heating process is then carried out to a temperature above the activation temperature of the flux up to the upper melting range of the solder in a second temperature treatment phase, wherein the solder melts and begins to connect to the respective joining partners. Furthermore, the thermal output previously applied is increased by an additional 5% to 30% in a third temperature treatment phase in order to accelerate the adhesion behavior of the joining partners.