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1. (WO2013124013) APPARATUS FOR COOLING ELECTRICAL COMPONENT PARTS

Pub. No.:    WO/2013/124013    International Application No.:    PCT/EP2012/073681
Publication Date: Fri Aug 30 01:59:59 CEST 2013 International Filing Date: Wed Nov 28 00:59:59 CET 2012
IPC: H01L 23/473
Applicants: SIEMENS AKTIENGESELLSCHAFT
Inventors: SCHWARZBAUER, Herbert
Title: APPARATUS FOR COOLING ELECTRICAL COMPONENT PARTS
Abstract:
The invention provides a cooling apparatus for dissipating symmetrical heat flows from electrical components (5) in such a way that in each case a cooling channel structure effecting local cooling directly at the component (5) is formed in a supporting body (1) supporting the component (5). As a result of this local cooling, a cooling power can be improved, with the result that a power density of semiconductor switches, for example, can be effectively increased.