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1. (WO2013123435) HEAT SPREADING SUBSTRATE WITH EMBEDDED INTERCONNECTS
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/123435 International Application No.: PCT/US2013/026498
Publication Date: 22.08.2013 International Filing Date: 15.02.2013
IPC:
H01L 23/14 (2006.01) ,H01L 21/48 (2006.01)
Applicants: MOHAMMED, Ilyas[US/US]; US
BEROZ, Masud[US/US]; US
INVENSAS CORPORATION[US/US]; 2702 Orchard Parkway San Jose, CA 95134, US
Inventors: MOHAMMED, Ilyas; US
BEROZ, Masud; US
Agent: MURABITO, Anthony, C.; Murabito Hao & Barnes LLP 2 N. Market Street Third Floor San Jose, CA 95113, US
Priority Data:
13/399,94117.02.2012US
Title (EN) HEAT SPREADING SUBSTRATE WITH EMBEDDED INTERCONNECTS
(FR) SUBSTRAT DE DIFFUSION DE CHALEUR À INTERCONNEXIONS INCORPORÉES
Abstract: front page image
(EN) Heat spreading substrate with embedded interconnects. In an embodiment in accordance with the present invention, an apparatus includes a metal parallelepiped comprising a plurality of wires inside the metal parallelepiped. The plurality of wires have a different grain structure than the metal parallelepiped. The plurality of wires are electrically isolated from the metal parallelepiped. The plurality of wires may be electrically isolated from one another.
(FR) L'invention concerne un substrat de diffusion de chaleur ayant des interconnections incorporées. Dans un mode de réalisation de la présente invention, un appareil comprend un parallélépipède métallique comportant une pluralité de fils à l'intérieur du parallélépipède métallique. La pluralité de fils ont une structure de grain différente de celle du parallélépipède métallique. La pluralité de fils sont isolés électriquement du parallélépipède métallique et peuvent être isolés électriquement les uns des autres.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)