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1. (WO2013122779) TECHNIQUES FOR HANDLING MEDIA ARRAYS
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/122779 International Application No.: PCT/US2013/024754
Publication Date: 22.08.2013 International Filing Date: 05.02.2013
IPC:
H01L 21/67 (2006.01) ,H01L 21/673 (2006.01) ,H01L 21/677 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
673
using specially adapted carriers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
Applicants: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.[US/US]; 35 Dory Road Gloucester, Massachusetts 01930, US
Inventors: FORDERHASE, Paul; US
BLAKE, Julian; US
WEAVER, William; US
Agent: DAISAK, Daniel; Kacvinsky Daisak PLLC 3120 Princeton Pike Suite 303 Lawrenceville, New Jersey 08648, US
Priority Data:
13/397,44115.02.2012US
Title (EN) TECHNIQUES FOR HANDLING MEDIA ARRAYS
(FR) TECHNIQUES PERMETTANT DE GÉRER POUR GÉRER DES MATRICES DE MATÉRIAUX
Abstract:
(EN) Techniques for handling media arrays are disclosed. The techniques may be realized as a system for handling a plurality of substrates. The system may comprise a plurality of row elements for supporting the plurality of substrates, wherein the plurality of row elements may be operable to change configuration of the substrates from open configuration to a high-density configuration, where a distance between adjacent substrates in the open configuration may be greater than a distance between the adjacent substrates in the high-density configuration.
(FR) La présente invention concerne des techniques permettant de gérer des matrices de matériaux. Les techniques peuvent être réalisées en tant que système destiné à gérer une pluralité de substrats. Le système peut comprendre une pluralité d'éléments de rangée permettant de soutenir la pluralité de substrats, la pluralité d'éléments de rangée pouvant être utilisable pour changer la configuration des substrats d'une configuration ouverte en une configuration à haute densité, une distance entre des substrats adjacents dans la configuration ouverte pouvant être supérieure à une distance entre les substrats adjacents dans la configuration à haute densité.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)