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Machine translation
1. (WO2013122570) PROCESSOR CARD HOUSING WITH FAN
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2013/122570    International Application No.:    PCT/US2012/024924
Publication Date: 22.08.2013 International Filing Date: 13.02.2012
IPC:
G06F 1/20 (2006.01)
Applicants: HAWLETT-PACKARD DEVELOPMENT COMPANY, LP [US/US]; 11445 Compaq Center Drive W Houston, Texas 77070 (US) (For All Designated States Except US).
OWEN, Richard [US/US]; (US) (For US Only).
BASSETT, Jonathan, D. [US/US]; (US) (For US Only).
QUIJANO, David [US/US]; (US) (For US Only)
Inventors: OWEN, Richard; (US).
BASSETT, Jonathan, D.; (US).
QUIJANO, David; (US)
Agent: FERGUSON, Christopher Ward; Hewlett-Packard Company Intellectual Property Administration 3404 E. Harmony Road, Mail Stop 35 Fort Collins, Colorado 80528-9599 (US)
Priority Data:
Title (EN) PROCESSOR CARD HOUSING WITH FAN
(FR) BOÎTIER DE CARTE DE PROCESSEUR AVEC VENTILATEUR
Abstract: front page image
(EN)A device can include a housing, a fan, and a heat sink. The heat sink can dissipate heat from a processor card. The device can be installed into a chassis of a computer.
(FR)L'invention concerne un dispositif qui peut comprendre un boîtier, un ventilateur, et un dissipateur thermique. Le dissipateur thermique peut dissiper la chaleur d'une carte de processeur. Le dispositif peut être installé dans un châssis d'ordinateur.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)