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1. (WO2013122126) SOLDER JOINT STRUCTURE, POWER MODULE, HEAT-SINK-ATTACHED SUBSTRATE FOR POWER MODULE, METHOD FOR PRODUCING SAID SUBSTRATE, AND PASTE FOR FORMING SOLDER UNDERLAYER

Pub. No.:    WO/2013/122126    International Application No.:    PCT/JP2013/053488
Publication Date: Fri Aug 23 01:59:59 CEST 2013 International Filing Date: Fri Feb 15 00:59:59 CET 2013
IPC: H01L 23/40
B23K 1/00
B23K 1/19
Applicants: MITSUBISHI MATERIALS CORPORATION
三菱マテリアル株式会社
Inventors: NISHIMOTO Shuji
西元 修司
NISHIKAWA Kimihito
西川 仁人
NAGATOMO Yoshiyuki
長友 義幸
Title: SOLDER JOINT STRUCTURE, POWER MODULE, HEAT-SINK-ATTACHED SUBSTRATE FOR POWER MODULE, METHOD FOR PRODUCING SAID SUBSTRATE, AND PASTE FOR FORMING SOLDER UNDERLAYER
Abstract:
A solder joint structure, a power module utilizing the joint structure, a heat-sink-attached substrate for a power module, a method for producing the substrate, and a paste for forming a solder underlayer. The paste is arranged on a metallic member and then fired, thereby reacting with an oxide coating film generated on the surface of the metallic member to form a solder underlayer on the metallic member. In this manner, it becomes possible to prevent the formation of swells or wrinkles on the surface of an aluminum member and it also becomes possible to improve the reliability of the joint between the aluminum member and a member to be joined to the aluminum member even under applying a power cycle or a heat cycle.