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1. (WO2013122021) SEMICONDUCTOR MEASUREMENT DEVICE AND COMPUTER PROGRAM

Pub. No.:    WO/2013/122021    International Application No.:    PCT/JP2013/053172
Publication Date: Fri Aug 23 01:59:59 CEST 2013 International Filing Date: Wed Feb 13 00:59:59 CET 2013
IPC: G01B 15/00
Applicants: HITACHI HIGH-TECHNOLOGIES CORPORATION
株式会社 日立ハイテクノロジーズ
Inventors: TOYODA Yasutaka
豊田 康隆
MATSUOKA Ryoichi
松岡 良一
Title: SEMICONDUCTOR MEASUREMENT DEVICE AND COMPUTER PROGRAM
Abstract:
The purpose of the invention is to provide a semiconductor measurement device capable of obtaining measurement results that appropriately reflect pattern deformation even when multiple pattern-deforming factors are intermixed. To achieve said purpose, a semiconductor measurement device, which measures the dimensions between multiple measurement points at different positions of the edge of a reference pattern and the multiple corresponding points of the circuit pattern of an electronic device that correspond to the multiple measurement points, is proposed. The semiconductor measurement device: measures distances between a circuit pattern and the reference pattern present inside a prescribed measurement region; selects, from a first measured value group obtained from the values measured at multiple sites in the measurement region, a second measured value group on the basis of a prescribed sampling condition; and determines a measured value on the basis of the second measured value group.