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Machine translation
1. (WO2013119062) COPPER PLATING SOLUTION
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/119062 International Application No.: PCT/KR2013/001005
Publication Date: 15.08.2013 International Filing Date: 07.02.2013
IPC:
C25D 3/38 (2006.01)
Applicants: HOJIN PLATECH CO., LTD.[KR/KR]; 1rotteu 15beulleok Banwolgongdan 91, 119beongil Mongnaero Danwon-gu Ansan-si Gyeonggi-do 425-100, KR
Inventors: KIM, Pan Soo; KR
LEE, Duk Haeng; KR
JUNG, Woon Suk; KR
Agent: LIM, Seung-Seop; LIM&JEONG PATENT LAW FIRM No. 303 seomeoset(royalpaelliseu), Susong-dong 85 Jongno-gu Seoul 110-885, KR
Priority Data:
10-2012-001264508.02.2012KR
Title (EN) COPPER PLATING SOLUTION
(FR) SOLUTION DE PLACAGE DE CUIVRE
(KO) 구리 도금용액
Abstract: front page image
(EN) The present invention relates to a copper plating solution for removing electro-plating stresses from an electrolytic copper plating film. According to the present invention, glycerin propoxylate ethoxylate is used in the electrolytic copper plating solution as a carrier for removing electro-plating stresses, and phenylurea is added as an additive for removing electro-plating stresses. The copper plating solution according to the present invention contains phenylurea at between 0.02g/l and 0.08g/l.
(FR) La présente invention concerne une solution de placage de cuivre destinée à l'élimination de contraintes d'électrodéposition provenant d'un film de placage électrolytique de cuivre. Selon la présente invention, du propoxylate-éthoxylate de glycérol est utilisé dans la solution de placage électrolytique de cuivre comme support destiné à l'élimination des contraintes d'électrodéposition et de la phénylurée est ajoutée comme additif destiné à l'élimination des contraintes d'électrodéposition. La solution de placage de cuivre selon la présente invention contient de la phénylurée en une concentration comprise entre 0,02 g/l et 0,08 g/l.
(KO) 본 발명은 전해구리 도금 피막의 전착응력을 해소하기 위한 구리 도금용액에 관한 것이다. 본 발명은 전해 구리 도금 용액에 전착응력을 해소하기 위한 케리어로 Glycerin propoxylate ethoxylate를 사용하고, 전착응력 해소 첨가제로 페닐우레아를 첨가하는 것을 특징으로 한다. 본 발명에서 있어서의 구리 도금 용액은 0.02~0.08g/l의 페닐우레아를 포함하게 된다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)