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1. (WO2013119032) METHOD FOR FORMING FUNCTIONAL COMPOSITION PATTERN ON SUBSTRATE, AND ELECTRONIC DEVICE INCLUDING FUNCTIONAL PATTERN FORMED BY SAID METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/119032 International Application No.: PCT/KR2013/000941
Publication Date: 15.08.2013 International Filing Date: 06.02.2013
IPC:
G03F 7/038 (2006.01) ,H05K 3/12 (2006.01) ,H05K 3/28 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
038
Macromolecular compounds which are rendered insoluble or differentially wettable
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
12
using printing techniques to apply the conductive material
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
Applicants: HANAMICRO INC.[KR/KR]; #536 Yongsan-dong Yuseong-gu Daejeon 305-500, KR
Inventors: LEE, Seung Seob; KR
KIM, Jin Ha; KR
KIM, Sang Bae; KR
LEE, Jung Woo; KR
Agent: DYNE PATENT & LAW FIRM; #705 7th Floor Jelzone Tower1 17-1 Jeongja-dong Bundang-gu Seongnam-si Gyeonggi-do 463-847, KR
Priority Data:
10-2012-001183706.02.2012KR
Title (EN) METHOD FOR FORMING FUNCTIONAL COMPOSITION PATTERN ON SUBSTRATE, AND ELECTRONIC DEVICE INCLUDING FUNCTIONAL PATTERN FORMED BY SAID METHOD
(FR) PROCÉDÉ DE FORMATION D'UN MOTIF EN UNE COMPOSITION FONCTIONNELLE SUR UN SUBSTRAT ET DISPOSITIF ÉLECTRONIQUE COMPORTANT LE MOTIF EN UNE COMPOSITION FONCTIONNELLE FORMÉ AU MOYEN DUDIT PROCÉDÉ
(KO) 기판 상에 기능성 조성물의 패턴을 형성하는 방법 및 그 방법에 의하여 형성된 기능성 패턴을 구비한 전자 장치
Abstract:
(EN) The present invention relates to a method for forming a functional composition pattern on a substrate, and to an electronic device that includes the functional composition pattern formed by said method. According to the method of the present invention, a functional composition is applied to the surface of a mold in which a concave pattern is formed, and the functional composition applied to the concave surface of the mold pattern is removed. A liquid thermosetting resin is applied to the surface of the mold where the pattern is formed, and the substrate is disposed on a thermosetting resin layer. The thermosetting resin layer is hardened and the mold is removed. Also, according to the present invention, the electronic device that includes the functional composition pattern disposed on the resin layer includes the substrate, the thermosetting resin layer disposed on one surface of the substrate, and the functional composition pattern formed on the thermosetting resin layer.
(FR) La présente invention concerne un procédé de formation d'un motif en une composition fonctionnelle sur un substrat et un dispositif électronique comportant le motif en une composition fonctionnelle formé au moyen dudit procédé. D'après le procédé de la présente invention, une composition fonctionnelle est appliquée à la surface d'un moule dans lequel un motif concave est formé, puis la composition fonctionnelle appliquée à la surface concave du motif du moule est retirée. Une résine thermodurcissable liquide est appliquée à la surface du moule dans lequel le motif est formé, puis le substrat est disposé sur une couche de résine thermodurcissable. La couche de résine thermodurcissable est durcie et le moule est retiré. En outre, d'après la présente invention, le dispositif électronique comportant le motif en une composition fonctionnelle disposé sur la couche de résine comprend le substrat, la couche de résine thermodurcissable disposée sur une surface du substrat et le motif en une composition fonctionnelle formé sur la couche de résine thermodurcissable.
(KO) 본 발명은 기판 상에 기능성 조성물의 패턴을 형성하는 방법 및 그 방법에 의하여 형성된 기능성 조성물 패턴을 구비한 전자장치에 관한 것이다. 본 발명의 방법은, 오목한 패턴이 형성된 몰드의 표면에 기능성 조성물을 도포하고, 몰드의 패턴의 볼록한 표면에 도포된 기능성 조성물을 제거한다. 패턴이 형성된 몰드의 표면에 액체 상태의 경화성 수지를 도포하고, 경화성 수지층 상에 기판을 배치한다. 경화성 수지층을 경화시키고, 몰드를 제거한다. 또한, 본 발명에 따른 수지층의 상부에 형성된 기능성 조성물 패턴을 포함하는 전자 장치는, 기판과, 기판의 일면에 형성된 경화성 수지층과, 경화성 수지층의 상부에 형성된 기능성 조성물 패턴을 포함한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)