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1. (WO2013118892) SURFACE TREATED METAL POWDER, AND MANUFACTURING METHOD FOR SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/118892 International Application No.: PCT/JP2013/053142
Publication Date: 15.08.2013 International Filing Date: 08.02.2013
IPC:
B22F 1/02 (2006.01) ,B22F 1/00 (2006.01) ,H01B 1/00 (2006.01) ,H01B 1/22 (2006.01) ,H01B 5/00 (2006.01) ,H01B 13/00 (2006.01) ,H01G 4/232 (2006.01) ,H01G 4/30 (2006.01) ,H05K 3/46 (2006.01)
Applicants: JX NIPPON MINING & METALS CORPORATION[JP/JP]; 6-3,Otemachi 2-chome,Chiyoda-ku, Tokyo 1008164, JP
Inventors: FURUSAWA,Hideki; JP
Agent: AXIS PATENT INTERNATIONAL; Shimbashi i-mark Bldg., 6-2 Shimbashi 2-Chome,Minato-ku, Tokyo 1050004, JP
Priority Data:
2012-02532808.02.2012JP
Title (EN) SURFACE TREATED METAL POWDER, AND MANUFACTURING METHOD FOR SAME
(FR) POUDRE MÉTALLIQUE TRAITÉE EN SURFACE, ET PROCÉDÉ DE FABRICATION DE CELLE-CI
(JA) 表面処理された金属粉、及びその製造方法
Abstract: front page image
(EN)  Provided is a surface treated metal powder that exhibits superior sinter delay properties, and that is suitable for use in the manufacture of electrodes for multilayer ceramic capacitor chips. In the EDS concentration profile of the area near the surface of the surface treated metal powder obtained by STEM, the depth of any among Ti, Al, Si, Zr, Ce and Sn is 1-25 nm.
(FR) L'invention concerne une poudre métallique traitée en surface qui présente des propriétés d'inhibition de frittage supérieures, et qui convient à des fins d'utilisation pour la fabrication d'électrodes pour des puces de condensateurs céramiques multicouches. Dans le profil des concentrations de spectroscopie à dispersion d'énergie de la zone à proximité de la surface de la poudre métallique traitée en surface obtenue par STEM, la profondeur de l'un quelconque parmi Ti, Al, Si, Zr, Ce et Sn est de 1 à 25 nm.
(JA)  チップ積層セラミックコンデンサー用電極の製造に好適に使用可能な、焼結遅延性に優れた、表面処理された金属粉を、STEMで得られる表面近傍のEDSの濃度profileにおいて、Ti、Al、Si、Zr、Ce、Snのいずれかの厚みが1~25nmである、表面処理された金属粉によって提供する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)