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1. (WO2013117704) MODULAR TERMINAL BLOCK
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2013/117704    International Application No.:    PCT/EP2013/052555
Publication Date: 15.08.2013 International Filing Date: 08.02.2013
IPC:
H01R 9/24 (2006.01), H01R 9/26 (2006.01), H01R 13/506 (2006.01)
Applicants: PHOENIX CONTACT GMBH & CO.KG [DE/DE]; Flachsmarktstrasse 8 32825 Blomberg (DE)
Inventors: CORRELL, Michael, Anthony; (US).
BARBER, Terry, Lee; (US).
BRAUNS, Michael; (DE)
Agent: BLUMBACH & ZINNGREBE; Alexandrastrasse 5 65187 Wiesbaden (DE)
Priority Data:
61/596,374 08.02.2012 US
13/647,440 09.10.2012 US
Title (EN) MODULAR TERMINAL BLOCK
(FR) BORNIER MODULAIRE
Abstract: front page image
(EN)A terminal block for mounting on a DIN rail includes a plurality of stacked modules with each module having a contact body and an extender body mounted on the contact body. A circuit board or electronic component is mounted on the contact body and the extender body. Different size extender bodies may be mounted on a common contact body to accommodate mounting different size circuit boards or components on the block.
(FR)Bornier destiné à être monté sur un rail DIN, comprenant une pluralité de modules empilés, chaque module ayant un corps de contact et un corps d'extension monté sur le corps de contact. Une carte de circuit ou un composant électronique est monté sur le corps de contact et le corps d'extension. Des corps d'extension de tailles différentes peuvent être montés sur un même corps de contact pour permettre le montage des cartes de circuit ou des composants des différentes tailles sur le bornier.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)