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1. (WO2013117580) NON-BLISTERING POLYAMIDE COMPOSITION

Pub. No.:    WO/2013/117580    International Application No.:    PCT/EP2013/052307
Publication Date: Fri Aug 16 01:59:59 CEST 2013 International Filing Date: Thu Feb 07 00:59:59 CET 2013
IPC: C08L 77/06
C08K 7/14
Applicants: DSM IP ASSETS B.V.
Inventors: BURGT VAN DER, Frank
DUIS, Patrick Gerardus
Title: NON-BLISTERING POLYAMIDE COMPOSITION
Abstract:
The invention relates to a polyamide composition with an increased resistance against blistering that is for example the result of a reflow soldering process. The composition comprises: A) 99- 50 wt% of at least one polyamide A derived from: A1) at least one di-amine monomer having 4 carbon atoms and wherein the amount of C4-diamine is at least 2 mol% relative to the total amount of di-amine and, A2) at least one di-acid monomer, wherein at least one of the monomers has at least one aromatic structural unit, and wherein the polyamide A, has a molecular weight, expressed as Mn, of at least 9000 g/mol, and B) 1 - 50 wt% of at least one reinforcing agent and C) 0- 20 wt% of inorganic fillers and/or additives, D) 0- 49 wt% of one or more polymers other than A) wherein the sum of A, B, C and D amounts to 100 wt%. The invention also relates to the use of the polyamide composition and to a shaped article made out of the polyamide composition.