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1. (WO2013116184) CONNECTING POWER LEADS TO CIRCUIT BOARD
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/116184 International Application No.: PCT/US2013/023544
Publication Date: 08.08.2013 International Filing Date: 29.01.2013
IPC:
H01R 12/51 (2011.01) ,H05K 1/18 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12
Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
50
Fixed connections
51
for rigid printed circuits or like structures
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
Applicants: FINN, Peter Andrew John[US/US]; US
A123 SYSTEMS, INC.[US/US]; 200 West Street Waltham, Massachusetts 02472, US
Inventors: FINN, Peter Andrew John; US
Agent: KRIZ, Paul P.; Chapin IP Law, LLC 352 Turnpike Road, Suite 110 Southborough, Massachusetts 01772, US
Priority Data:
61/592,41530.01.2012US
Title (EN) CONNECTING POWER LEADS TO CIRCUIT BOARD
(FR) PROCÉDÉ DE CONNEXION DE CONDUCTEURS D'ALIMENTATION SUR UNE CARTE DE CIRCUIT IMPRIMÉ
Abstract:
(EN) An assembler receives a circuit board. The circuit board includes at least a first node and a second node that are adjacent but electrically isolated from each other. There is a gap between the first node and the second node. The first node is electrically isolated from other components on the circuit board. The second node is electrically coupled to circuitry residing on the circuit board. The assembler initiates positioning of a conductive lead of a battery in a vicinity of the first node. The gap between the first node and second node initially prevents the live conductive lead from being in electrical contact with the second node. Eventually, the assembler bridges the gap to provide an electrical connection between at least the conductive lead and the second node to electrically couple the conductive lead to the second node and thus the circuitry residing on the circuit board.
(FR) Le procédé selon l'invention comprend les étapes suivantes : un moteur reçoit une carte de circuit imprimé ; ladite carte de circuit imprimé comprend au moins un premier nœud et un second nœud adjacents mais électriquement isolés l'un de l'autre ; un espacement sépare le premier nœud du second nœud ; le premier nœud est électriquement isolé des autres composants de la carte de circuit imprimé ; le second nœud est en contact électrique avec le câblage disposé sur la carte de circuit imprimé ; le monteur commence à positionner un conducteur d'une batterie à proximité du premier nœud ; l'espacement entre le premier nœud et le second nœud empêche initialement le conducteur sous tension d'entrer en contact électrique avec le second nœud ; par la suite, le monteur comble l'écart pour assurer le contact électrique entre au moins le conducteur et le second nœud pour coupler le conducteur au second nœud et donc au câblage disposé sur la carte de circuit imprimé.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)