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1. (WO2013116143) A BOARD-LEVEL HEAT TRANSFER APPARATUS FOR COMMUNICATION PLATFORMS
Latest bibliographic data on file with the International Bureau   
Pub. No.: WO/2013/116143 International Application No.: PCT/US2013/023405
Publication Date: 08.08.2013 International Filing Date: 28.01.2013
IPC:
H05K 7/20 (2006.01) ,H05K 7/14 (2006.01) ,H04Q 1/02 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
14
Mounting supporting structure in casing or on frame or rack
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
Q
SELECTING
1
Details of selecting apparatus or arrangements
02
Constructional details
Applicants: ALCATEL LUCENT[FR/FR]; 148/152, route de la Reine F-92100 Boulogne-Billancourt, FR
Inventors: LING, Wei; US
MESSANA, Salvatore; US
ROMINSKI, Paul; US
Agent: MC CABE, John, F.; Alcatel-lucent USA Inc. Attention: Docket Administrator-room 3B-212F 600-700 Mountain Avenue Murray Hill, NJ 07974-0636, US
Priority Data:
13/360,99730.01.2012US
Title (EN) A BOARD-LEVEL HEAT TRANSFER APPARATUS FOR COMMUNICATION PLATFORMS
(FR) APPAREIL DE TRANSFERT THERMIQUE NIVEAU CARTE POUR PLATEFORMES DE COMMUNICATION
Abstract:
(EN) An apparatus, comprising a rack and a cooler. The apparatus also comprises a plurality of electronic circuit boards located in corresponding slots of the rack, each of the electronic circuit boards being held against a portion of the cooler by a corresponding force, some of the electronic circuit boards having a localized heat source thereon The apparatus also comprises a plurality of heat spreaders, each heat spreader configured to form a heat conducting path over and adjacent to one of the electronic circuit boards from one or more of the localized heat sources thereon to the portion of the cooler. The apparatus also comprises a plurality of compliant thermal interface pads, each of the pads being compressed between end of one of the heat spreaders and the portion of the cooler to form a heat conduction path therebetween.
(FR) Cette invention concerne un appareil comprenant un bâti et un refroidisseur. Ledit appareil comprend en outre une pluralité de cartes de circuit électronique disposées dans des fentes correspondantes du bâti, chacune des cartes de circuit électronique étant retenue contre une partie du refroidisseur par une force correspondante. Certaines des cartes de circuit électronique comportent une source de chaleur localisée. Ledit appareil comprend en outre une pluralité de dissipateurs thermiques, chaque dissipateur thermique étant conçu pour former un passage de conduction thermique au-dessus d'une ou plusieurs carte(s) de circuit électronique et de manière adjacente à celle(s)-ci, à partir d'une ou plusieurs des sources de chaleur localisées vers la partie du refroidisseur. Ledit appareil comprend enfin une pluralité de pastilles souples d'interface thermique, chacune des pastilles étant comprimée entre une l'extrémité d'un des dissipateurs thermiques et la partie du refroidisseur pour former entre ceux-ci un chemin de conduction thermique.
 front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)