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1. (WO2013115899) SENSOR OVER-MOLD SHAPE

Pub. No.:    WO/2013/115899    International Application No.:    PCT/US2012/066171
Publication Date: Fri Aug 09 01:59:59 CEST 2013 International Filing Date: Thu Nov 22 00:59:59 CET 2012
IPC: A61B 5/0215
A61B 5/03
Applicants: MEDTRONIC, INC.
Inventors: FLO, Daniel S.
CARNEY, James K.
MOTHILAL, Kamal Deep
SCHELL, Jon D.
Title: SENSOR OVER-MOLD SHAPE
Abstract:
An implantable sensor module includes a housing having an inner shell and an outer layer formed to extend over and enclose the inner shell to form an outer wall of the housing, the inner shell having a thickness extending between an inner wall of the inner shell and an outer wall of the inner shell, the outer layer having an inner side engaged against the outer wall of the inner shell and having a thickness extending between the inner side and the outer wall of the housing, wherein the inner shell and the outer layer form a substantially flat portion. A flexible diaphragm is formed within the inner shell and extends between a first edge and a second edge, and a shoulder extends adjacent to the first edge to extend the outer layer laterally away from a central medial line extending between the first and second edges of the diaphragm.