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Machine translation
1. (WO2013115338) FLAME-RETARDANT HEAT-CONDUCTIVE ADHESIVE SHEET
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/115338 International Application No.: PCT/JP2013/052268
Publication Date: 08.08.2013 International Filing Date: 31.01.2013
IPC:
C09J 7/02 (2006.01) ,C09J 201/00 (2006.01)
Applicants: NITTO DENKO CORPORATION[JP/JP]; 1-2, Shimo-hozumi 1-chome, Ibaraki-shi, Osaka 5678680, JP
Inventors: FURUTA, Kenji; JP
TERADA, Yoshio; JP
Agent: OKAMOTO, Hiroyuki; c/o IKUMI PATENT ATTORNEYS OFFICE, Central Shin-Osaka Building 3rd Floor, 5-36, Miyahara 4-chome, Yodogawa-ku, Osaka-shi, Osaka 5320003, JP
Priority Data:
2012-02083502.02.2012JP
Title (EN) FLAME-RETARDANT HEAT-CONDUCTIVE ADHESIVE SHEET
(FR) FEUILLE ADHÉSIVE THERMOCONDUCTRICE IGNIFUGE
(JA) 難燃性熱伝導性粘着シート
Abstract: front page image
(EN) A flame-retardant heat-conductive adhesive sheet having: a base material; and a flame-retardant heat-conductive adhesive layer provided on at least one surface of the base material. The base material comprises a polyester film, the ratio of the thickness of the base material to the overall thickness of the flame-retardant heat-conductive adhesive sheet is less than 0.2, and the heat resistance is no greater than 10cm2⋅K/W.
(FR) L'invention concerne une feuille adhésive thermoconductrice ignifuge comprenant : un matériau de base; et une couche adhésive thermoconductrice ignifuge disposée sur au moins une surface du matériau de base. Le matériau de base comprend un film de polyester, le rapport entre l'épaisseur du matériau de base et l'épaisseur totale de la feuille adhésive thermoconductrice ignifuge étant inférieur à 0,2, et la résistance à la chaleur étant inférieure ou égale à 10 cm2⋅K/W.
(JA)  難燃性熱伝導性粘着シートは、基材と、基材の少なくとも片面に設けられた難燃性熱伝導性粘着剤層とを有する難燃性熱伝導性粘着シートである。基材がポリエステルフィルムを含み、かつ、難燃性熱伝導性粘着シートの総厚に対する基材の厚みの比が0.2未満であり、熱抵抗が10cm・K/W以下である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)