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1. (WO2013115256) WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

Pub. No.:    WO/2013/115256    International Application No.:    PCT/JP2013/052059
Publication Date: Fri Aug 09 01:59:59 CEST 2013 International Filing Date: Thu Jan 31 00:59:59 CET 2013
IPC: C23C 18/36
C23C 18/44
H05K 1/09
Applicants: TOPPAN PRINTING CO., LTD.
凸版印刷株式会社
NATIONAL UNIVERSITY CORPORATION GUNMA UNIVERSITY
国立大学法人群馬大学
Inventors: TSUCHIDA Tetsuyuki
土田 徹勇起
OKUBO Toshikazu
大久保 利一
SHOHJI Ikuo
荘司 郁夫
KANO Takahiro
狩野 貴宏
Title: WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
Abstract:
A wiring board (1) is provided with: an electrode (12) that is configured of Cu or a Cu alloy; and a plating film (14) that has an electroless nickel plating layer (18) which is formed on the electrode (12) and an electroless gold plating layer (22) which is formed on the electroless nickel plating layer (18). The electroless nickel plating layer (18) is formed by co-deposition of Ni, P, Bi and S. The electroless nickel plating layer (18) has a P content of 5% by mass or more but less than 10% by mass, a Bi content of 1-1,000 ppm by mass and an S content of 1-2,000 ppm by mass. The mass ratio of the S content to the Bi content (S/Bi) is more than 1.0.