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|1. (WO2013115256) WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD|
|Applicants:||TOPPAN PRINTING CO., LTD.
NATIONAL UNIVERSITY CORPORATION GUNMA UNIVERSITY
|Title:||WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD|
A wiring board (1) is provided with: an electrode (12) that is configured of Cu or a Cu alloy; and a plating film (14) that has an electroless nickel plating layer (18) which is formed on the electrode (12) and an electroless gold plating layer (22) which is formed on the electroless nickel plating layer (18). The electroless nickel plating layer (18) is formed by co-deposition of Ni, P, Bi and S. The electroless nickel plating layer (18) has a P content of 5% by mass or more but less than 10% by mass, a Bi content of 1-1,000 ppm by mass and an S content of 1-2,000 ppm by mass. The mass ratio of the S content to the Bi content (S/Bi) is more than 1.0.