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1. (WO2013115187) RELEASE FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING SAME

Pub. No.:    WO/2013/115187    International Application No.:    PCT/JP2013/051917
Publication Date: Fri Aug 09 01:59:59 CEST 2013 International Filing Date: Wed Jan 30 00:59:59 CET 2013
IPC: B29C 33/68
B29C 43/18
B29C 45/02
H01L 21/56
C08F 214/26
C08J 5/18
Applicants: ASAHI GLASS COMPANY, LIMITED
旭硝子株式会社
Inventors: KASAI, Wataru
笠井 渉
HIGUCHI, Yoshiaki
樋口 義明
ATAKU, Masakazu
安宅 真和
TAGUCHI, Daisuke
田口 大輔
OTSUGU, Satoshi
大継 聡
Title: RELEASE FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
Abstract:
Provided are a release film which, even when the mold is large and complex, is not prone to uneven thickness of the release film when this is stretched, and a method of manufacturing a semiconductor device in which distortion of the surface of the resin sealing part is suppressed even when the resin sealing part is large and complex. The release film (30) used is arranged on a cavity surface (26) of a mold which, by sealing a semiconductor element (a light-emitting element (12), etc.) of a semiconductor device (a light-emitting diode (1), etc.) with a curable sealing resin, forms a resin sealing unit (lens unit (14), etc.). The release film has a tensile elasticity modulus at 132°C measured in accordance with JIS K 7127 of 10-24MPa, and a peel force of 0.8N/25mm or less.