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|1. (WO2013115187) RELEASE FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING SAME|
|Applicants:||ASAHI GLASS COMPANY, LIMITED
|Title:||RELEASE FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING SAME|
Provided are a release film which, even when the mold is large and complex, is not prone to uneven thickness of the release film when this is stretched, and a method of manufacturing a semiconductor device in which distortion of the surface of the resin sealing part is suppressed even when the resin sealing part is large and complex. The release film (30) used is arranged on a cavity surface (26) of a mold which, by sealing a semiconductor element (a light-emitting element (12), etc.) of a semiconductor device (a light-emitting diode (1), etc.) with a curable sealing resin, forms a resin sealing unit (lens unit (14), etc.). The release film has a tensile elasticity modulus at 132°C measured in accordance with JIS K 7127 of 10-24MPa, and a peel force of 0.8N/25mm or less.