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1. (WO2013115110) SEPARATION CONTROL METHOD, AND CONTROL DEVICE FOR PLASMA PROCESSING DEVICE

Pub. No.:    WO/2013/115110    International Application No.:    PCT/JP2013/051654
Publication Date: Fri Aug 09 01:59:59 CEST 2013 International Filing Date: Sat Jan 26 00:59:59 CET 2013
IPC: H01L 21/683
Applicants: TOKYO ELECTRON LIMITED
東京エレクトロン株式会社
Inventors: KAWABATA, Atsushi
川端 淳史
Title: SEPARATION CONTROL METHOD, AND CONTROL DEVICE FOR PLASMA PROCESSING DEVICE
Abstract:
 Provided is a separation control method for separating an item to be processed from an electrostatic chuck which has a chuck electrode and which electrostatically adheres the item to be processed, said method being characterised by comprising: a step for measuring the current flowing from the chuck electrode for a prescribed time period once the voltage to the chuck electrode, which had been ON, is set to OFF after plasma processing, thus obtaining a time integration value for the current; a step for calculating the difference between the time integration value for the current and the electric charge charged to the chuck electrode during plasma processing; a step for calculating, from the abovementioned difference, a counter voltage which depends on the remaining electric charge of the electrostatic chuck, on the basis of the correlation between a predetermined current time integration value and the torque acting on a support pin supporting the item to be processed; and a step for setting the counter voltage to ON for the chuck electrode, whilst introducing gas into a processing chamber and generating plasma.