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1. (WO2013114952) SHEET-DETACHING DEVICE AND DETACHING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/114952 International Application No.: PCT/JP2013/050733
Publication Date: 08.08.2013 International Filing Date: 17.01.2013
IPC:
H01L 21/683 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
Applicants:
リンテック株式会社 LINTEC CORPORATION [JP/JP]; 東京都板橋区本町23番23号 23-23, Honcho, Itabashi-ku, Tokyo 1730001, JP
Inventors:
杉下 芳昭 SUGISHITA Yoshiaki; JP
Agent:
特許業務法人樹之下知的財産事務所 KINOSHITA & ASSOCIATES; 東京都杉並区荻窪五丁目26番13号 荻窪TMビル3階 3rd floor, Ogikubo TM building, 26-13, Ogikubo 5-chome, Suginami-ku, Tokyo 1670051, JP
Priority Data:
2012-01818231.01.2012JP
Title (EN) SHEET-DETACHING DEVICE AND DETACHING METHOD
(FR) DISPOSITIF DE DÉTACHEMENT DE FEUILLE ET PROCÉDÉ DE DÉTACHEMENT
(JA) シート剥離装置および剥離方法
Abstract:
(EN) This sheet-detaching device (1) is equipped with: a supporting means (2) that has a tilted surface (21) which is tilted with respect to a horizontal plane and is for supporting a plate-like member (WF), which has an adhesive sheet (AS) applied to one surface, from the other surface side by means of the tilted surface (21); a feeding means (3) for feeding a detaching tape (PT); an application means (5) for applying the detaching tape (PT), which is fed by the feeding means (3), to the adhesive sheet (AS); and a moving means (6) for moving the supporting means (2) and the application means (5) relative to each other in the in-plane direction of the tilted surface (21) in order to detach the adhesive sheet (AS) from the plate-like member (WF).
(FR) Dispositif de détachement de feuille (1) équipé d'un moyen de support (2) présentant une surface inclinée (21), qui est inclinée par rapport à un plan horizontal et destinée à supporter un élément de type plaque (WF), doté d'une feuille adhésive (AS) appliquée sur une surface, à partir de l'autre face au moyen de la surface inclinée (21) ; un moyen d'alimentation (3) pour transporter une bande de détachement (PT) ; un moyen d'application (5) pour appliquer la bande de détachement (PT), qui est transportée par le moyen d'alimentation (3), à la feuille adhésive (AS) ; et un moyen de déplacement (6) pour déplacer le moyen de support (2) et le moyen d'application (5) l'un par rapport à l'autre dans le plan de la surface inclinée (21) afin de détacher la feuille adhésive (AS) de l'élément de type plaque (WF).
(JA)  シート剥離装置(1)は、水平面に対して傾斜した傾斜面(21)を有し、一方の面に接着シート(AS)が貼付された板状部材(WF)を当該傾斜面(21)で他方の面側から支持する支持手段(2)と、剥離用テープ(PT)を繰り出す繰出手段(3)と、繰出手段(3)で繰り出された剥離用テープ(PT)を接着シート(AS)に貼付する貼付手段(5)と、支持手段(2)と貼付手段(5)とを傾斜面(21)の面内方向に相対移動させて板状部材(WF)から接着シート(AS)を剥離する移動手段(6)とを備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)