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1. (WO2013114912) CHIP COMPONENT AND METHOD FOR PRODUCING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/114912 International Application No.: PCT/JP2013/050082
Publication Date: 08.08.2013 International Filing Date: 08.01.2013
IPC:
H01C 13/02 (2006.01) ,H01C 1/14 (2006.01) ,H01C 7/00 (2006.01) ,H01C 17/06 (2006.01) ,H01G 4/255 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
C
RESISTORS
13
Resistors not provided for elsewhere
02
Structural combinations of resistors
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
C
RESISTORS
1
Details
14
Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
C
RESISTORS
7
Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
C
RESISTORS
17
Apparatus or processes specially adapted for manufacturing resistors
06
adapted for coating resistive material on a base
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
G
CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
4
Fixed capacitors; Processes of their manufacture
002
Details
255
Means for correcting the capacitance value
Applicants: ROHM CO., LTD.[JP/JP]; 21, Saiin Mizosaki-cho, Ukyo-ku, Kyoto-shi, Kyoto 6158585, JP
Inventors: KONDO, Yasuhiro; JP
TAMAGAWA, Hiroshi; JP
YAMAMOTO, Hiroki; JP
Agent: INAOKA, Kosaku; c/o AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS, Sun Mullion NBF Tower, 21st Floor, 6-12, Minamihommachi 2-chome, Chuo-ku, Osaka-shi, Osaka 5410054, JP
Priority Data:
2012-02229603.02.2012JP
2012-04230028.02.2012JP
2012-06797023.03.2012JP
2012-08162730.03.2012JP
2012-27707919.12.2012JP
Title (EN) CHIP COMPONENT AND METHOD FOR PRODUCING SAME
(FR) COMPOSANT DE PUCE, ET PROCÉDÉ DE FABRICATION DE CELUI-CI
(JA) チップ部品およびその製造方法
Abstract:
(EN) [Problem] To provide a compact, highly-reliable chip component, such as a chip resistor, having an exact resistance value. [Solution] A chip resistor (10) includes: a substrate (11); a plurality of resistors, each having a resistor film (20) formed on the substrate (11), and an aluminum wiring film (21) laminated in such a manner as to be in contact with the resistor film (20); electrodes (11, 12) disposed on the substrate (11); and a plurality of fuses (F) having an aluminum wiring film integrated with the aforementioned aluminum wiring film (21) of the plurality of resistors, and having the ability to cut a connection between the plurality of resistors and each of the electrodes (11, 12). [Effect] By cutting arbitrarily-defined fuses among the plurality of fuses, the resistance value of the chip resistor can be matched to a desired resistance value. Furthermore, the fuses are constituted by the aluminum wiring film, the layout of the fuses can be finely manipulated, and processing precision in a cutting step is improved.
(FR) L'invention fournit un composant de puce, tel qu'une résistance pavé, de haute fiabilité, de petite taille, et possédant une valeur ohmique précise. La résistance pavé de l'invention (10) contient : un substrat (11); une pluralité de résistances possédant chacune un film de résistance (20) formé sur ledit substrat (11), et un film de câblage d'aluminium (21) stratifié de sorte à toucher ledit film de résistance (20); des électrodes (11, 12) agencées sur ledit substrat (11); et une pluralité de fusibles (F) possédant un film de câblage d'aluminium solidarisé audit film de câblage d'aluminium (21) de ladite pluralité de résistances, et permettant de couper la connexion individuelle de ladite pluralité de résistances aux électrodes (11, 12). Par coupure d'un fusible quelconque de la pluralité de fusibles, il est possible de faire correspondre la valeur ohmique de la résistance pavé, à une valeur ohmique souhaitée. Enfin, les fusibles sont configurés par un film de câblage d'aluminium, leur dessin est défini minutieusement, et leur précision d'usinage lors de l'étape de coupure est améliorée.
(JA) 【課題】小型で正確な抵抗値を有する信頼性の高いチップ部品、たとえばチップ抵抗器を提供すること。【解決手段】基板11と、前記基板11上に形成された抵抗体膜20および前記抵抗体膜20に接するように積層されたアルミニウム系配線膜21をそれぞれ有する複数の抵抗体と、前記基板11上に設けられた電極11,12と、前記複数の抵抗体の前記アルミニウム系配線膜21と一体化したアルミニウム系配線膜を有し、前記複数の抵抗体を前記電極11,12にそれぞれ接続する切断可能な複数のヒューズFとを含むチップ抵抗器10である。【効果】複数のヒューズのうちの任意のヒューズを切断することにより、チップ抵抗器の抵抗値を所望の抵抗値に合わせ込むことができる。また、ヒューズはアルミニウム系配線膜で構成されており、そのレイアウトを微細に作れ、切断工程における加工精度も向上する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)