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1. (WO2013114870) PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING METHOD

Pub. No.:    WO/2013/114870    International Application No.:    PCT/JP2013/000487
Publication Date: Fri Aug 09 01:59:59 CEST 2013 International Filing Date: Thu Jan 31 00:59:59 CET 2013
IPC: H01L 21/3065
H01L 21/205
H01L 21/304
H05H 1/00
H05H 1/46
Applicants: TOKYO ELECTRON LIMITED
東京エレクトロン株式会社
Inventors: AKIMOTO, Toshikazu
秋元 敏和
KANNAN, Hiroshi
河南 博
Title: PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING METHOD
Abstract:
[Problem] To precisely suppress fluctuation and unevenness in a plasma process in one-time sheet plasma processing. [Solution] An OES measurement unit (110) outputs a spectroscopic measurement value (MOESi) at, or immediately after, the completion of each step. A CD estimation unit (140) uses the spectroscopic measurement value (MOESi) and a CD estimation model (AMi), introduced from an estimation model storage unit (142), to find a CD estimation value (ACDi) for each step. In the automatic control of a subject (130) to be controlled, a process control unit (132) uses, for the next step, the CD estimation value (ACDi) for the previous step, taken from the CD estimation unit (140), in addition to a process condition setting value (PCi+1), for the next-step, introduced from a recipe storage unit (136), and a process control model (CMi+1), for the next step, introduced from a control model storage unit (138).