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1. (WO2013112691) LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2013/112691    International Application No.:    PCT/US2013/022899
Publication Date: 01.08.2013 International Filing Date: 24.01.2013
IPC:
H01L 25/075 (2006.01)
Applicants: COOLEDGE LIGHTING INC. [CA/CA]; Unit 1A-3751 North Fraser Way Burnaby, BC V5J 5G4 (CA).
TISCHLER, Michael, Albert [US/US]; (US)
Inventors: TISCHLER, Michael, Albert; (US)
Agent: CURRIE, Matthew, T.; Bingham McCutchen LLP 2020 K. Street, NW Washington, DC 20006 (US)
Priority Data:
61/589,908 24.01.2012 US
61/589,909 24.01.2012 US
Title (EN) LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS
(FR) PUCES ÉLECTROLUMINESCENTES INCORPORANT DES MATÉRIAUX DE CONVERSION DE LONGUEUR D'ONDE ET PROCÉDÉS ASSOCIÉS
Abstract: front page image
(EN)In accordance with certain embodiments, light emitting diodes, i.e. semiconductor dies (210) are embedded within polymeric binder (420; 230) which contains in a specific embodment phosphor, to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies (210) embedded in a single volume of binder (420; 230). In the methods of certain embodiments the contacts of the semicondctor dies (210) remain at least partially uncoated by the binder, or are reexposed to ambient after applying the binder (420; 230) before the dies are separated.
(FR)La présente invention se rapporte, selon certains modes de réalisation, à des puces de semi-conducteur qui sont intégrées dans un liant polymère afin de former, par exemple, des puces indépendantes émettant une lumière blanche et/ou des plaquettes composites qui contiennent de multiples puces électroluminescentes intégrées dans un seul volume de liant.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)