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1. (WO2013112650) REMOTE THERMAL COMPENSATION ASSEMBLY
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/112650 International Application No.: PCT/US2013/022827
Publication Date: 01.08.2013 International Filing Date: 24.01.2013
IPC:
F21V 23/00 (2006.01) ,F21V 23/04 (2006.01) ,H05B 33/08 (2006.01) ,F21Y 101/02 (2006.01)
Applicants: CREE, INC.[US/US]; 4600 Silicon Drive Durham, North Carolina 27703, US
Inventors: DEMUYNCK, Randy; US
PROGL, Curt; US
Agent: KNORS, Christopher J.; Moore & Van Allen, Pllc Po Box 13706 Research Triangle Park, North Carolina 27709, US
Priority Data:
13/358,93826.01.2012US
Title (EN) REMOTE THERMAL COMPENSATION ASSEMBLY
(FR) ENSEMBLE DE COMPENSATION THERMIQUE À DISTANCE
Abstract: front page image
(EN) A thermal compensating circuit board (TCB) assembly (75) comprising a substrate, the substrate comprising at least one thermal compensating circuit (71) deposited thereon, and at least one electrical connector coupled to the at least one thermal compensating circuit (71), the connector configured to couple with a solid state emitter assembly (212) and/or power supply (204). Lighting devices (100) comprising the TCB assembly (75) are provided.
(FR) L'invention concerne un ensemble (75) carte de circuit de compensation thermique (TCB) comprenant un substrat, le substrat comprenant au moins un circuit de compensation thermique (71) déposé sur celui-ci, et au moins un connecteur électrique couplé à l'au moins un circuit de compensation thermique (71), le connecteur étant configuré pour se coupler avec un ensemble émetteur à semi-conducteur (212) et/ou une alimentation électrique (204). L'invention concerne également des dispositifs d'éclairage (100) comprenant l'ensemble TCB (75).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)