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1. (WO2013111687) VIBRATION MEASURING DEVICE AND VIBRATION MEASURING METHOD

Pub. No.:    WO/2013/111687    International Application No.:    PCT/JP2013/050965
Publication Date: Fri Aug 02 01:59:59 CEST 2013 International Filing Date: Sat Jan 19 00:59:59 CET 2013
IPC: G01H 1/00
Applicants: MEIDENSHA CORPORATION
株式会社明電舎
Inventors: MAEZATO, Norihiro
前里 哲博
MASUI, Masaru
増井 勝
Title: VIBRATION MEASURING DEVICE AND VIBRATION MEASURING METHOD
Abstract:
Vibration measuring devices that measure vibrations by pressing a vibration sensor on a measuring surface of an object to be measured using a compression spring or the like are unable to accurately measure vibrations due to the pressing force exerted by the compression spring or the like. This vibration measuring device (1) is provided with: a vibration sensor (2); a sensor holder (3) to which the vibration sensor (2) is attached so as to be able to move vertically by being fitted to the leading end of the sensor holder; and a sensor attachment/separation mechanism (4) that allows the vibration sensor (2) to be attached to/separated from a measuring surface of an object to be measured via the sensor holder (3). The vibration sensor (2) is provided with a probe plate (9) provided with flange-like projections (5) and vibration measuring elements (7) at the top, and is provided with a magnet (10) at the bottom. The sensor holder (3) is provided with: openings (17) that allow the magnet (10) at the lower end of the vibration sensor (2) to protrude at the bottom end; and projection engagement sections (16) that engage with the bottoms of the flange-like projections (5) of the vibration sensor (2), thereby preventing the vibration sensor (2) from falling out from the openings (17).