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1. (WO2013111676) PHOTOELECTRIC CONVERSION ELEMENT, METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION ELEMENT, SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2013/111676 International Application No.: PCT/JP2013/050893
Publication Date: 01.08.2013 International Filing Date: 18.01.2013
IPC:
H01L 27/146 (2006.01) ,H01L 27/14 (2006.01) ,H04N 5/369 (2011.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144
Devices controlled by radiation
146
Imager structures
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
30
Transforming light or analogous information into electric information
335
using solid-state image sensors [SSIS]
369
SSIS architecture; Circuitry associated therewith
Applicants:
ソニー株式会社 SONY CORPORATION [JP/JP]; 東京都港区港南1丁目7番1号 1-7-1, Konan, Minato-ku, Tokyo 1080075, JP
Inventors:
藤井 宣年 FUJII Nobutoshi; JP
岩元 勇人 IWAMOTO Hayato; JP
Agent:
特許業務法人つばさ国際特許事務所 TSUBASA PATENT PROFESSIONAL CORPORATION; 東京都新宿区新宿1丁目15番9号さわだビル3階 3F, Sawada Building, 15-9, Shinjuku 1-chome, Shinjuku-ku, Tokyo 1600022, JP
Priority Data:
2012-01265425.01.2012JP
Title (EN) PHOTOELECTRIC CONVERSION ELEMENT, METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION ELEMENT, SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE
(FR) ÉLÉMENT DE CONVERSION PHOTOÉLECTRIQUE, PROCÉDÉ DE FABRICATION D'ÉLÉMENT DE CONVERSION PHOTOÉLECTRIQUE, DISPOSITIF IMAGEUR À L'ÉTAT SOLIDE ET DISPOSITIF ÉLECTRONIQUE
(JA) 光電変換素子、光電変換素子の製造方法、固体撮像装置および電子機器
Abstract:
(EN) This method for manufacturing a photoelectric conversion element comprises: a step wherein a first electrode is formed on a first surface side of a substrate that has two opposite surfaces; a step wherein an electrode part for external connection is formed on a second surface side of the substrate; and a step wherein an organic photoelectric conversion layer and a second electrode are formed on the first electrode after the formation of the first electrode and the electrode part.
(FR) Cette invention concerne un procédé de fabrication d'un élément de conversion photoélectrique, comprenant : une étape consistant à former une première électrode sur une première surface d'un substrat présentant deux surfaces opposées ; une étape consistant à former une partie d'électrode, destinée à la connexion externe, sur une seconde surface du substrat ; et une étape consistant à former une couche organique de conversion photoélectrique et une seconde électrode sur la première électrode après la formation de la première électrode et de la partie d'électrode.
(JA)  光電変換素子の製造方法は、対向する2面を有する基板の第1面側に第1電極を形成する工程と、基板の第2面側に外部接続用の電極部を形成する工程と、第1電極および電極部を形成した後、第1電極上に有機光電変換層および第2電極を形成する工程とを含む。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)