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1. (WO2013111637) SOLID-STATE IMAGE PICKUP APPARATUS, METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP APPARATUS, AND ELECTRONIC APPARATUS

Pub. No.:    WO/2013/111637    International Application No.:    PCT/JP2013/050553
Publication Date: Fri Aug 02 01:59:59 CEST 2013 International Filing Date: Wed Jan 16 00:59:59 CET 2013
IPC: H01L 27/146
H01L 31/10
Applicants: SONY CORPORATION
ソニー株式会社
Inventors: TAKAHASHI Hirotsugu
高橋 裕嗣
Title: SOLID-STATE IMAGE PICKUP APPARATUS, METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP APPARATUS, AND ELECTRONIC APPARATUS
Abstract:
This solid-state image pickup apparatus is provided with: a p-type compound semiconductor layer having a chalcopyrite structure; an electrode formed on the p-type compound semiconductor layer; and an n-type layer, which is separately formed by each pixel, said n-type layer being formed on the p-type compound semiconductor layer surface on the side opposite to the light incoming side of the p-type compound semiconductor layer.