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1. WO2013105582 - ADHESIVE COMPOSITION, ADHESIVE TAPE, AND METHOD FOR PROCESSING WAFER

Publication Number WO/2013/105582
Publication Date 18.07.2013
International Application No. PCT/JP2013/050237
International Filing Date 09.01.2013
IPC
C09J 201/00 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
C09J 7/02 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
02on carriers
C09J 11/06 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
06organic
C09J 133/06 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
133Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
04Homopolymers or copolymers of esters
06of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
CPC
C08K 5/3472
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
16Nitrogen-containing compounds
34Heterocyclic compounds having nitrogen in the ring
3467having more than two nitrogen atoms in the ring
3472Five-membered rings
C09J 11/06
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
02Non-macromolecular additives
06organic
C09J 2203/326
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2203Applications of adhesives in processes or use of adhesives in the form of films or foils
326for bonding electronic components such as wafers, chips or semiconductors
C09J 2301/408
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2301Additional features of adhesives in the form of films or foils
40characterized by the presence of essential components
408additives as essential feature of the adhesive layer
C09J 2301/416
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2301Additional features of adhesives in the form of films or foils
40characterized by the presence of essential components
416use of irradiation
C09J 2301/502
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2301Additional features of adhesives in the form of films or foils
50characterized by process specific features
502process for debonding adherents
Applicants
  • 積水化学工業株式会社 SEKISUI CHEMICAL CO., LTD. [JP]/[JP]
Inventors
  • 利根川 亨 TONEGAWA Toru
  • 麻生 隆浩 ASAO Takahiro
Agents
  • 特許業務法人 安富国際特許事務所 YASUTOMI & ASSOCIATES
Priority Data
2012-00440512.01.2012JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) ADHESIVE COMPOSITION, ADHESIVE TAPE, AND METHOD FOR PROCESSING WAFER
(FR) COMPOSITION ADHÉSIVE, BANDE ADHÉSIVE, ET PROCÉDÉ DE TRAITEMENT D'UNE PLAQUETTE DE SEMI-CONDUCTEURS
(JA) 粘着剤組成物、粘着テープ、及び、ウエハの処理方法
Abstract
(EN) The purpose of the present invention is to provide: an adhesive composition having excellent heat resistance, which has high adhesive power and can still be easily released; an adhesive tape which uses the adhesive composition; and a method for processing a wafer, wherein the adhesive tape is used. The present invention is an adhesive composition which contains a photocurable adhesive component, a photopolymerization initiator, and a gas generator that generates a gas when irradiated with light. The gas generator is dispersed in the adhesive composition with a dispersion diameter of 0.05-37 μm.
(FR) L'objet de cette invention est de pourvoir à : une composition adhésive ayant une excellente résistance à la chaleur, un pouvoir adhésif élevé et peut toujours être facile à enlever ; une bande adhésive l'utilisant ; et un procédé de traitement d'une plaquette de semi-conducteurs, utilisant ladite bande adhésive. La composition adhésive selon l'invention contient un composant adhésif photodurcissable, un amorceur de photopolymérisation, et un générateur de gaz qui génère un gaz quand il est exposé à la lumière. Le générateur de gaz est dispersé dans la composition adhésive à un diamètre de dispersion de 0,05 à 37 µm.
(JA) 本発明は、高い接着力を有する一方で容易に剥離でき、かつ、耐熱性に優れる粘着剤組成物、該粘着剤組成物を用いた粘着テープ、及び、該粘着テープを用いたウエハの処理方法を提供することを目的とする。 本発明は、光硬化型の粘着剤成分、光重合開始剤、及び、光を照射することにより気体を発生する気体発生剤を含有する粘着剤組成物であって、前記気体発生剤は、粘着剤組成物中に0.05~37μmの分散径で分散している粘着剤組成物である。 
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