Processing

Please wait...

Settings

Settings

Goto Application

1. WO2013103130 - HIGH-FREQUENCY TRANSMISSION LINE AND ELECTRICAL DEVICE

Publication Number WO/2013/103130
Publication Date 11.07.2013
International Application No. PCT/JP2012/083970
International Filing Date 27.12.2012
IPC
H01P 3/08 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3Waveguides; Transmission lines of the waveguide type
02with two longitudinal conductors
08Microstrips; Strip lines
CPC
H01P 3/08
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3Waveguides; Transmission lines of the waveguide type
02with two longitudinal conductors
08Microstrips; Strip lines
H01P 3/085
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3Waveguides; Transmission lines of the waveguide type
02with two longitudinal conductors
08Microstrips; Strip lines
085Triplate lines
H05K 1/0225
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0213Electrical arrangements not otherwise provided for
0216Reduction of cross-talk, noise or electromagnetic interference
0218by printed shielding conductors, ground planes or power plane
0224Patterned shielding planes, ground planes or power planes
0225Single or multiple openings in a shielding, ground or power plane
H05K 1/0298
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
0298Multilayer circuits
H05K 1/0393
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0393Flexible materials
H05K 1/11
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP]
Inventors
  • 加藤 登 KATO Noboru
  • 小澤 真大 OZAWA Masahiro
Agents
  • 特許業務法人プロフィック特許事務所 PROFIC PC
Priority Data
2012-00098806.01.2012JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) HIGH-FREQUENCY TRANSMISSION LINE AND ELECTRICAL DEVICE
(FR) LIGNE DE TRANSMISSION HAUTE FRÉQUENCE ET DISPOSITIF ÉLECTRIQUE
(JA) 高周波伝送線路及び電子機器
Abstract
(EN) Provided are a high-frequency transmission line and electrical device making it possible to reduce cross-talk between two intersecting signal lines, and making it possible to reduce the thickness of a portion where two signal lines intersect in a laminate. A signal line (21) is provided closer to one side in a lamination direction than a signal line (20) within a dielectric body (12), and intersects with the signal line (20). A ground conductor (24) is provided closer to the other side in the lamination direction than the signal line (20). A ground conductor (22) is provided closer to the one side in the lamination direction than the signal line (21). A middle ground (27) overlaps with a portion where the signal lines (20, 21) intersect and is provided between the signal lines (20, 21). The surface area where the ground conductor (22) overlaps with the signal line (20) is smaller than the surface area where the ground conductor (24) overlaps with the signal line (20). The surface area where the ground conductor (24) overlaps with the signal line (21) is smaller than the surface area where the ground conductor (22) overlaps with the signal line (21).
(FR) L'invention concerne une ligne de transmission haute fréquence et un dispositif électrique, permettant de réduire la diaphonie entre deux lignes de signaux se coupant et permettant de réduire l'épaisseur d'une partie au niveau de laquelle deux lignes de signaux se coupent dans un stratifié. Une ligne de signaux (21) est prévue plus proche d'un côté dans une direction de stratification qu'une ligne de signaux (20) à l'intérieur d'un corps diélectrique (12) et coupe la ligne de signaux (20). Un conducteur de terre (24) est prévu plus proche de l'autre côté dans la direction de stratification que la ligne de signaux (20). Un conducteur de terre (22) est prévu plus proche du premier côté dans la direction de stratification que la ligne de signaux (21). Une masse intermédiaire (27) chevauche une partie au niveau de laquelle les lignes de signaux (20, 21) se coupent et elle est prévue entre les lignes de signaux (20, 21). La zone de surface dans laquelle le conducteur de terre (22) chevauche la ligne de signaux (20) est plus petite que la zone de surface dans laquelle le conducteur de terre (24) chevauche la ligne de signaux (20). La zone de surface dans laquelle le conducteur de terre (24) chevauche la ligne de signaux (21) est plus petite que la zone de surface dans laquelle le conducteur de terre (22) chevauche la ligne de signaux (21).
(JA)  交差している2本の信号線路間のクロストークを低減できると共に、積層体において2本の信号線路が交差している部分の厚みを低減できる高周波伝送線路及び電子機器を提供することである。 信号線路21は、誘電体素体12において信号線路20よりも積層方向の一方側に設けられ、信号線路20と交差している。グランド導体24は、信号線路20よりも積層方向の他方側に設けられている。グランド導体22は、信号線路21よりも積層方向の一方側に設けられている。中間グランド27は、信号線路20,21が交差している部分と重なり、かつ、信号線路20,21間に設けられている。グランド導体22が信号線路20と重なっている面積は、グランド導体24が信号線路20と重なっている面積よりも小さい。グランド導体24が信号線路21と重なっている面積は、グランド導体22が信号線路21と重なっている面積よりも小さい。
Latest bibliographic data on file with the International Bureau