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1. (WO2013057917) METHOD FOR MANUFACTURING THIN SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2013/057917    International Application No.:    PCT/JP2012/006594
Publication Date: 25.04.2013 International Filing Date: 15.10.2012
IPC:
G02F 1/13 (2006.01), C03B 33/02 (2006.01), C03C 15/00 (2006.01), G02F 1/1333 (2006.01)
Applicants: SHARP KABUSHIKI KAISHA [JP/JP]; 22-22, Nagaike-cho, Abeno-ku, Osaka-shi, Osaka 5458522 (JP) (For All Designated States Except US).
MAKINO, Hiroki; (US only).
NAGAOKA, Gen; (US only).
KIRA, Takatoshi; (US only)
Inventors: MAKINO, Hiroki; .
NAGAOKA, Gen; .
KIRA, Takatoshi;
Agent: MAEDA & PARTNERS; Osaka-Marubeni Bldg.5F, 5-7, Hommachi 2-chome, Chuo-ku, Osaka-shi, Osaka 5410053 (JP)
Priority Data:
2011-230775 20.10.2011 JP
Title (EN) METHOD FOR MANUFACTURING THIN SUBSTRATE
(FR) PROCÉDÉ DE FABRICATION D'UN SUBSTRAT MINCE
(JA) 薄型基板の製造方法
Abstract: front page image
(EN)A method for manufacturing a thin substrate includes the following steps: a first etching step in which the thickness of a glass substrate (110a) is reduced by etching one surface of the glass substrate (110a); a scribing step in which a scribe groove (Ca) for dividing a glass substrate (110b), which is formed by reducing the thickness of the glass substrate (110a), is formed on a surface of the glass substrate (110b); and a second etching step in which the thickness of a glass substrate (110c), which is formed by forming the scribe groove (Ca) on the glass substrate (110b), is reduced by etching a surface of the glass substrate (110c), and the glass substrate (110c) is divided by way of the scribe groove (Ca).
(FR)L'invention concerne un procédé de fabrication d'un substrat mince, qui comporte les étapes suivantes : une première étape de gravure, dans laquelle l'épaisseur d'un substrat de verre (110a) est réduite par une gravure mise en oeuvre sur une surface dudit substrat (110a) ; une étape de rainurage, dans laquelle une rainure (Ca) servant à diviser un substrat de verre (110b), formé par la réduction de l'épaisseur dudit substrat (110a), est formée sur une surface du substrat de verre (110b) ; et une seconde étape de gravure, dans laquelle l'épaisseur du substrat de verre (110c), formé par la formation de la rainure (Ca) sur le substrat de verre (110b), est réduite par la gravure d'une surface dudit substrat (110c), et le substrat de verre (110c) est divisé au moyen de ladite rainure (Ca).
(JA) ガラス基板(110a)の一方の表面をエッチングすることにより、ガラス基板(110a)の厚さを薄くする第1エッチング工程と、ガラス基板(110a)を薄くしたガラス基板(110b)の表面にガラス基板(110b)を分割するためのスクライブ溝(Ca)を形成するスクライブ工程と、ガラス基板(110b)にスクライブ溝(Ca)を形成したガラス基板(110c)の表面をエッチングすることにより、ガラス基板(110c)の厚さを薄くすると共に、スクライブ溝(Ca)を介してガラス基板(110c)を分割する第2エッチング工程とを備える。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)