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1. (WO2013054870) POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING RESIN PATTERN, CURED PRODUCT, AND OPTICAL MEMBER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2013/054870    International Application No.:    PCT/JP2012/076408
Publication Date: 18.04.2013 International Filing Date: 12.10.2012
IPC:
G03F 7/039 (2006.01), C08F 220/26 (2006.01), G03F 7/004 (2006.01), H01L 21/027 (2006.01)
Applicants: FUJIFILM CORPORATION [JP/JP]; 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620 (JP)
Inventors: FUJIMORI Junichi; (JP).
SHIMONO Katsuhiro; (JP).
KUBOTA Makoto; (JP).
SUZUKI Shigekazu; (JP)
Agent: NOGUCHI Yasuhiro; NOGUCHI PATENT FIRM, Urban Toranomon Bldg., 16-4, Toranomon 1-chome, Minato-ku, Tokyo 1050001 (JP)
Priority Data:
2011-224474 12.10.2011 JP
Title (EN) POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING RESIN PATTERN, CURED PRODUCT, AND OPTICAL MEMBER
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE DE TYPE POSITIVE, ARTICLE DURCI AINSI QUE PROCÉDÉ DE FABRICATION DE CELUI-CI, PROCÉDÉ DE FABRICATION DE MOTIF EN RÉSINE, ET ÉLÉMENT OPTIQUE
(JA) ポジ型感光性樹脂組成物、硬化物の製造方法、樹脂パターン製造方法、硬化物及び光学部材
Abstract: front page image
(EN)The purpose of the present invention is to provide a positive photosensitive resin composition with which dissolution of unexposed portions during development can be prevented. The positive photosensitive resin composition of the present invention is characterized in comprising (component A) inorganic particles, (component B)a dispersant having acid groups, (component C) a solvent, (component D) a polymer comprising (a-1) structural units having groups that are eliminated in the presence of acid and/or heat and (a-2) structural units having crosslinkable groups, and (component E)a photoacid generator, wherein the acid value of component D is 50 mg KOH/g or less.
(FR)L'invention a pour objectif de fournir une composition de résine photosensible de type positive permettant d'inhiber la dissolution d'une partie non exposée pendant un développement. Cette composition de résine photosensible de type positive comprend : des particules inorganiques (composant A); un agent de dispersion possédant un radical à fonction acide (composant B); un solvant (composant C); un polymère qui possède une unité structurale ayant un groupe se détachant sous l'effet d'un acide et/ou de la chaleur (a-1), et une unité structurale ayant un groupe réticulable (a-2) (composant D); et un agent générateur de photo-acide (composant E). La composition de résine photosensible de type positive est caractéristique en ce que l'indice d'acidité du composant (D) est inférieur ou égal à 50mgKOH/g.
(JA) 現像時における未露光部の溶解を抑制することができるポジ型感光性樹脂組成物を提供することを目的とする。 本発明のポジ型感光性樹脂組成物は、(成分A)無機粒子、(成分B)酸基を有する分散剤、(成分C)溶剤、(成分D)(a-1)酸及び/又は熱によって脱離する基を有する構成単位と(a-2)架橋性基を有する構成単位とを有する重合体、並びに、(成分E)光酸発生剤を含有し、成分Dの酸価が、50mgKOH/g以下であることを特徴とする。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)