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1. WO2013054790 - STRUCTURE CONTAINING CONDUCTOR CIRCUIT, METHOD FOR MANUFACTURING SAME, AND HEAT-CURABLE RESIN COMPOSITION

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Publication Number WO/2013/054790
Publication Date 18.04.2013
International Application No. PCT/JP2012/076130
International Filing Date 09.10.2012
IPC
H05K 3/46 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multi-layer circuits
H05K 3/00 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
CPC
G03F 7/16
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
16Coating processes; Apparatus therefor
G03F 7/20
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
G03F 7/26
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26Processing photosensitive materials; Apparatus therefor
G03F 7/40
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26Processing photosensitive materials; Apparatus therefor
40Treatment after imagewise removal, e.g. baking
H01L 21/4857
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
4814Conductive parts
4846Leads on or in insulating or insulated substrates, e.g. metallisation
4857Multilayer substrates
H01L 23/49822
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49822Multilayer substrates
Applicants
  • 日立化成株式会社 HITACHI CHEMICAL COMPANY, LTD. [JP]/[JP]
Inventors
  • 蔵渕　和彦 KURAFUCHI Kazuhiko
  • 藤本　大輔 FUJIMOTO Daisuke
  • 山田　薫平 YAMADA Kunpei
  • 名越　俊昌 NAGOSHI Toshimasa
Agents
  • 長谷川　芳樹 HASEGAWA Yoshiki
Priority Data
2011-22434111.10.2011JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) STRUCTURE CONTAINING CONDUCTOR CIRCUIT, METHOD FOR MANUFACTURING SAME, AND HEAT-CURABLE RESIN COMPOSITION
(FR) STRUCTURE CONTENANT UN CIRCUIT CONDUCTEUR, PROCÉDÉ DE FABRICATION DE CELLE-CI ET COMPOSITION DE RÉSINE THERMODURCISSABLE
(JA) 導体回路を有する構造体及びその製造方法並びに熱硬化性樹脂組成物
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Abstract
(EN) This method for manufacturing a structure having a conductor circuit forms a first photo-sensitive resin layer into a pattern in a first pattern-forming step, in accordance with the shape of an opening formed on a heat-curable resin layer, whereby it is possible to provide an opening of a variety of shapes. In the method for manufacturing the structure having the conductor circuit, in addition to being possible to simultaneously form a plurality of openings, it is possible to decrease residue of the resin in the area surrounding the opening, unlike a case where an opening is formed by a laser. Therefore, even when the number of pins in a semiconductor element is increased and a need arises to provide numerous small openings, it is possible to adequately and efficiently manufacture a structure having excellent reliability.
(FR) La présente invention porte sur un procédé de fabrication d'une structure ayant un circuit conducteur, qui forme une première couche de résine photosensible dans un motif dans une première étape de formation de motif, selon la forme d'une ouverture formée sur une couche de résine thermodurcissable, ce par quoi il est possible de fournir une ouverture d'une diversité de formes. Dans le procédé de fabrication de la structure ayant le circuit conducteur, en plus de la possibilité de former de manière simultanée une pluralité d'ouvertures, il est possible de diminuer un résidu de résine dans la zone entourant l'ouverture, contrairement à un cas où une ouverture est formée par un laser. Ainsi, même lorsque le nombre de broches dans un élément semi-conducteur est augmenté et qu'un besoin survient de fournir de nombreuses ouvertures petites, il est possible de fabriquer de manière adéquate et efficace une structure ayant une excellente fiabilité.
(JA) 　本発明に係る導体回路を有する構造体の製造方法は、熱硬化性樹脂層に形成する開口の形状に合わせて、第１のパターン化工程において第１の感光性樹脂層をパターン化することにより、様々な形状の開口を設けることができる。また、この導体回路を有する構造体の製造方法では、レーザで開口を形成する場合とは異なり、複数の開口を同時に形成できることに加え、開口周辺の樹脂の残渣を低減できる。このため、半導体素子のピン数が増加し、多数の微細な開口を設ける必要が生じた場合でも、優れた信頼性を有する構造体を充分に効率的に製造することができる。
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