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1. (WO2013052672) POWER MANAGEMENT APPLICATIONS OF INTERCONNECT SUBSTRATES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2013/052672    International Application No.:    PCT/US2012/058762
Publication Date: 11.04.2013 International Filing Date: 04.10.2012
IPC:
H01L 23/12 (2006.01), H05K 3/46 (2006.01)
Applicants: VOLTERRA SEMICONDUCTOR CORPORATION [US/US]; 47467 Fremont Boulevard Fremont, California 94538-6537 (US)
Inventors: MICHAEL, Mihalis; (US).
TAN, Kwang Hong; (SG).
JERGOVIC, Ilija; (US).
CHIANG, Chiteh; (US).
STRATAKOS, Anthony; (US)
Agent: VILLENEUVE, Joseph M.; WEAVER AUSTIN VILLENEUVE & SAMPSON LLP P. O. Box 70250 Oakland, California 94612-0250 (US)
Priority Data:
61/544,945 07.10.2011 US
Title (EN) POWER MANAGEMENT APPLICATIONS OF INTERCONNECT SUBSTRATES
(FR) APPLICATIONS DE GESTION DE PUISSANCE DES SUBSTRATS D'INTERCONNEXION
Abstract: front page image
(EN)Various applications of interconnect substrates in power management systems are described.
(FR)L'invention a trait à diverses applications de substrats d'interconnexion dans des systèmes de gestion de puissance.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)