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Machine translation
1. (WO2013051395) BONDING DEVICE AND BONDED SUBSTRATE MANUFACTURED USING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2013/051395    International Application No.:    PCT/JP2012/073952
Publication Date: 11.04.2013 International Filing Date: 19.09.2012
IPC:
H01L 21/02 (2006.01), H01L 21/677 (2006.01), H01L 27/12 (2006.01)
Applicants: SHARP KABUSHIKI KAISHA [JP/JP]; 22-22, Nagaike-cho, Abeno-ku, Osaka-shi, Osaka 5458522 (JP) (For All Designated States Except US).
SUGA, Katsuyuki; (US only)
Inventors: SUGA, Katsuyuki;
Agent: HARAKENZO WORLD PATENT & TRADEMARK; Daiwa Minamimorimachi Building, 2-6, Tenjinbashi 2-chome Kita, Kita-ku, Osaka-shi, Osaka 5300041 (JP)
Priority Data:
2011-223247 07.10.2011 JP
Title (EN) BONDING DEVICE AND BONDED SUBSTRATE MANUFACTURED USING SAME
(FR) DISPOSITIF DE SOUDURE ET SUBSTRAT SOUDÉ FABRIQUÉ À L'AIDE DE CELUI-CI
(JA) 接着装置およびそれを用いて作製した接着基板
Abstract: front page image
(EN)A bonding device (20) according to an embodiment of the present invention is provided with: a transporting film (7) which is elastic and on which an Si wafer (1) can be disposed; a chamber (6) which is divided into a bonding chamber (9) and an adjoining chamber (10), the bonding chamber (9) being configured to bond the Si wafer (1) to a glass substrate (2); and a pressure change means which decreases the pressure in the bonding chamber (9) to cause the transporting film (7) to extend so that the Si wafer (1) is brought into contact with the glass substrate (2).
(FR)La présente invention concerne, dans un de ses modes de réalisation, un dispositif (20) de soudure comportant : un film (7) de transport qui est élastique et sur lequel peut être disposée une tranche (1) de Si; une chambre (6) qui est divisée en une chambre (9) de soudure et une chambre voisine (10), la chambre (9) de soudure étant configurée pour souder la tranche (1) de Si à un substrat (2) en verre; et un moyen de changement de pression qui diminue la pression dans la chambre (9) de soudure pour faire en sorte que le film (7) de transport s'allonge de telle façon que la tranche (1) de Si soit amenée au contact du substrat (2) en verre.
(JA) 本発明の一態様に係る接着装置(20)は、伸縮性を有した、Siウエハー(1)を配することができる搬送用フィルム(7)と、接着室(9)および隣接室(10)に分断されるチャンバー(6)であって、接着室(9)において、Siウエハー(1)とガラス基板(2)とを接着する構成となっているチャンバー(6)と、接着室(9)の減圧等を行うことにより搬送用フィルム(7)を伸長させて、Siウエハー(1)をガラス基板(2)に接触させる圧力変化手段と、を備えている。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)