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Machine translation
1. (WO2013051162) MOLDING DEVICE AND MOLDING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2013/051162    International Application No.:    PCT/JP2011/076877
Publication Date: 11.04.2013 International Filing Date: 22.11.2011
IPC:
B29C 51/08 (2006.01), B29C 51/10 (2006.01), B29C 51/32 (2006.01)
Applicants: Asano Laboratories Co., Ltd. [JP/JP]; 158-247, Kitayama, Morowa, Togo-cho, Aichi-gun, Aichi 4700151 (JP) (For All Designated States Except US).
MIZOGUCHI Kenichi [JP/JP]; (JP) (For US Only).
TERAMOTO Kazunori [JP/JP]; (JP) (For US Only)
Inventors: MIZOGUCHI Kenichi; (JP).
TERAMOTO Kazunori; (JP)
Agent: SHIGA Masatake; 1-9-2, Marunouchi, Chiyoda-ku, Tokyo 1006620 (JP)
Priority Data:
2011-220292 04.10.2011 JP
2011-220296 04.10.2011 JP
Title (EN) MOLDING DEVICE AND MOLDING METHOD
(FR) DISPOSITIF DE MOULAGE ET PROCÉDÉ DE MOULAGE
(JA) 成形装置および成形方法
Abstract: front page image
(EN)A molding device provided with: a substrate jig provided on a base; a bonding means for bonding to a substrate held on the substrate jig a sheet having an adhesive layer, the sheet having been applied to the substrate, and a trimming means for trimming the sheet adhered to the substrate without removing the substrate from the substrate jig.
(FR)La présente invention concerne un dispositif de moulage pourvu : d'un gabarit de substrat prévu sur une base ; d'un moyen de collage permettant de coller sur un substrat maintenu sur un gabarit de substrat une feuille présentant une couche adhésive, la feuille ayant été appliquée sur le substrat, et d'un moyen d'ébarbage permettant d'ébarber la feuille collée au substrat sans retirer le substrat d'un gabarit de substrat.
(JA)基台上に設けられた基材治具と、前記基材治具上に保持された基材に対して被覆された、接着層を有するシートを前記基材に接着する接着手段と、前記シートを接着した前記基材に対し、該基材を前記基材治具から取り外すことなくその状態で前記シートのトリミングを行うトリミング手段と、を備える成形装置。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)