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1. WO2013050813 - LIQUID COOLING DEVICE FOR ELECTRONIC CARDS

Publication Number WO/2013/050813
Publication Date 11.04.2013
International Application No. PCT/IB2012/000471
International Filing Date 14.03.2012
IPC
G06F 1/20 2006.1
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/-G06F13/82
16Constructional details or arrangements
20Cooling means
H01L 23/367 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367Cooling facilitated by shape of device
H05K 7/20 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
G06F 1/20
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
20Cooling means
G06F 2200/201
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
2200Indexing scheme relating to G06F1/04 - G06F1/32
20Indexing scheme relating to G06F1/20
201Cooling arrangements using cooling fluid
H05K 7/20636
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20536for racks or cabinets of standardized dimensions, e.g. 19-inch electronic racks
20627Liquid coolant without phase change
20636within sub-racks for removing heat from electronic boards
Applicants
  • EUROTECH SPA [IT]/[IT] (AllExceptUS)
  • ROSSI, Mauro [IT]/[IT] (UsOnly)
Inventors
  • ROSSI, Mauro
Agents
  • PETRAZ, Davide, Luigi
Priority Data
UD2011A00004015.03.2011IT
Publication Language English (en)
Filing Language Italian (IT)
Designated States
Title
(EN) LIQUID COOLING DEVICE FOR ELECTRONIC CARDS
(FR) DISPOSITIF DE REFROIDISSEMENT LIQUIDE POUR CARTES ÉLECTRONIQUES
Abstract
(EN) Liquid cooling device for electronic cards (11) comprising a plurality of electronic modules (20, 20a, 20b; 120), such as memory modules or similar electronic components, associated to a printed circuit board (15) and disposed inclined with respect to the latter by a first acute angle (a). The device comprises at least a heat exchange mean (25) provided with at least a cooling circuit (27) through which a cooling liquid passes and disposed, when in use, with a heat exchange surface (31) parallel to the printed circuit board (15). The heat exchange surface (31) comprises a plurality of cavities (30) having a contact surface (32) inclined with respect to the heat exchange surface (31) by a second acute angle (β). Interposition means (26, 26a, 26b; 126) are conformed to be associated to at least one of the electronic modules (20, 20a, 20b; 120) and to be interposed between the contact surface (32) and at least a support element (17, 37) associated to the printed circuit board (15).
(FR) La présente invention concerne un dispositif de refroidissement liquide pour cartes électroniques (11) comportant une pluralité de modules électroniques (20, 20a, 20b; 120), tels que des modules de mémoire ou des composants électroniques analogues, associés à une carte de circuit imprimé (15) et disposés inclinés par rapport à celle-ci par un premier angle aigu (α). Le dispositif comporte au moins un moyen d'échange thermique (25) muni d'au moins un circuit de refroidissement (27) à travers lequel circule un liquide de refroidissement et disposé, en utilisation, avec une surface d'échange thermique (31) parallèle à la carte de circuit imprimé (15). La surface d'échange thermique (31) comporte une pluralité de cavités (30) comprenant une surface de contact (32) inclinée par rapport à la surface d'échange thermique (31) par un second angle aigu (β). Des moyens d'interposition (26, 26a, 26b; 126) sont conformés pour être associés à au moins un des modules électroniques (20, 20a, 20b; 120) et pour être interposés entre la surface de contact (32) et au moins un élément de support (17, 37) associé à la carte de circuit imprimé (15).
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