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1. (WO2013050332) FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2013/050332    International Application No.:    PCT/EP2012/069388
Publication Date: 11.04.2013 International Filing Date: 01.10.2012
IPC:
C23C 18/40 (2006.01)
Applicants: ATOTECH DEUTSCHLAND GMBH [DE/DE]; Erasmusstrasse 20 10553 Berlin (DE)
Inventors: STEINHÄUSER, Edith; (DE).
RÖSELER, Sandra; (DE).
WIESE, Stefanie; (DE).
NGUYEN, Tang Cam Lai; (DE).
STAMP, Lutz; (DE)
Agent: BRESSEL UND PARTNER; Potsdamer Platz 10 10785 Berlin (DE)
Priority Data:
11183991.6 05.10.2011 EP
Title (EN) FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION
(FR) SOLUTION POUR CUIVRAGE AUTOCATALYTIQUE EXEMPTE DE FORMALDÉHYDE
Abstract: front page image
(EN)The invention relates to an electroless aqueous copper plating solution, comprising a source of copper ions, a source of glyoxylic acid as reducing agent, and at least one polyamino disuccinic acid or at least one polyamino monosuccinic acid, or a mixture of at least one polyamino disuccinic acid and at least one polyamino monosuccinic acid as complexing agent, as well as to a method for electroless copper plating utilizing said solution and the use of the solution for the plating of substrates.
(FR)La présente invention porte sur une solution aqueuse pour cuivrage autocatalytique, comprenant une source d'ions cuivre, une source d'acide glyoxylique servant d'agent réducteur et au moins un acide polyaminodisuccinique ou au moins un acide polyaminomonosuccinique, ou un mélange d'au moins un acide polyaminodisuccinique et d'au moins un acide polyaminomonosuccinique servant d'agent complexant, ainsi que sur un procédé pour le cuivrage autocatalytique utilisant ladite solution et sur l'utilisation de la solution pour le placage de substrats.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)