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1. (WO2013049938) ELECTRONIC COMPONENTS ACCOMMODATED BY A CAVITY OF THE CURRENT PCM OR BY A CAVITY OF THE ADJACENT PCM TO MINIMIZE HEIGHT OF CAVITIES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2013/049938    International Application No.:    PCT/CA2012/050699
Publication Date: 11.04.2013 International Filing Date: 04.10.2012
IPC:
H05K 1/14 (2006.01), H05K 1/18 (2006.01), H05K 3/28 (2006.01), H05K 3/40 (2006.01)
Applicants: SIERRA WIRELESS, INC. [CA/CA]; 13811 Wireless Way Richmond, British Columbia V6V 3A4 (CA)
Inventors: SYAL, Ashish; (CA).
SAMUELS, Bruce Richard John; (CA).
POURSEYED, Behrouz; (CA).
MYTTING, Chris; (CA).
SCHERPEREEL, Audrey; (FR).
NEWMAN, Paul; (CA)
Agent: MBM INTELLECTUAL PROPERTY LAW LLP; 700 - 700 West Pender Street Vancouver, British Columbia V6C 1G8 (CA)
Priority Data:
61/542,951 04.10.2011 US
Title (EN) ELECTRONIC COMPONENTS ACCOMMODATED BY A CAVITY OF THE CURRENT PCM OR BY A CAVITY OF THE ADJACENT PCM TO MINIMIZE HEIGHT OF CAVITIES
(FR) BOÎTIER ÉLECTRONIQUE TRIDIMENSIONNEL
Abstract: front page image
(EN)Solutions for providing stackable electronics packaging are provided. In some embodiments, electronic components are accommodated in the cavity of a printed circuit board (PCB) or printed circuit assembly (PCA), or co-accommodated in adjoining cavities of adjacent, stacked PCAs or PCBs. The cavities allow for closer stacking of the PCAs or PCBs. In some embodiments, a PCA comprises an encapsulant conformally layered over a PCB with electronic components mounted on top and bottom. Power and/or signal channels are routed through the encapsulant to the top and/or bottom layers. The encapsulated PCAs may be stacked. In various embodiments, stackable PCAs are modular, facilitating customization.
(FR)L'invention concerne des solutions permettant d'obtenir des boîtiers électroniques empilables. Dans certains modes de réalisation, des composants électroniques sont logés dans la cavité d'une carte de circuits imprimés (PCB) ou d'un ensemble de circuits imprimés (PCA) ou sont logés ensemble dans des cavités adjacentes de PCA ou de PCB adjacents empilés. Les cavités permettent un empilement plus dense des PCA ou PCB. Dans certains modes de réalisation, un PCA comprend un agent d'encapsulation placé au-dessus d'une PCB, des composants électroniques étant montés au-dessus et au-dessous. Des canaux de puissance et/ou de signaux sont routés au travers de l'agent d'encapsulation vers les couches supérieures et/ou inférieures. Les PCA encapsulés peuvent être empilés. Dans différents modes de réalisation, les PCA empilables sont modulaires, ce qui facilite l'individualisation.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)