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Machine translation
1. (WO2013048685) METHODS OF FORMING THROUGH-SUBSTRATE VIAS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2013/048685    International Application No.:    PCT/US2012/053792
Publication Date: 04.04.2013 International Filing Date: 05.09.2012
IPC:
H01L 21/28 (2006.01), H01L 21/3205 (2006.01), H01L 21/768 (2006.01)
Applicants: MICRON TECHNOLOGY, INC. [US/US]; (A Corporation of the State Of Delaware) 8000 South Federal Way Boise, ID 83716 (US) (For All Designated States Except US).
ENGLAND, Luke, G. [US/US]; (US) (For US Only)
Inventors: ENGLAND, Luke, G.; (US)
Agent: MATKIN, Mark S.; Wells St. John P.S. 601 West First Avenue Suite 1300 Spokane, Washington 99201 (US)
Priority Data:
13/247,769 28.09.2011 US
Title (EN) METHODS OF FORMING THROUGH-SUBSTRATE VIAS
(FR) PROCÉDÉS DE FORMATION DE TROUS DE RACCORDEMENT À TRAVERS UN SUBSTRAT
Abstract: front page image
(EN)A method of forming through-substrate vias includes separately electrodepositing copper and at least one element other than copper to fill remaining volume of through-substrate via openings formed within a substrate. The electrodeposited copper and the at least one other element are annealed to form an alloy of the copper and the at least one other element which is used in forming conductive through-substrate via structures that include the alloy.
(FR)L'invention concerne un procédé de formation de trous de raccordement à travers un substrat qui consiste à déposer par voie électrolytique de façon séparée du cuivre et au moins un élément autre que le cuivre pour remplir un volume restant d'ouvertures de trous de raccordement à travers un substrat, formées à l'intérieur d'un substrat. Le cuivre et le ou les autres éléments déposés par voie électrolytique sont recuits pour former un alliage du cuivre et du ou des autres éléments, qui est utilisé dans la formation de structures conductrices de trous de raccordement à travers un substrat qui comprennent l'alliage.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)