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1. (WO2013048473) FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED VIA THERMAL COMPRESSION BONDING PROCESS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2013/048473    International Application No.:    PCT/US2011/054389
Publication Date: 04.04.2013 International Filing Date: 30.09.2011
IPC:
H05K 3/32 (2006.01), H05K 1/18 (2006.01), H01L 21/60 (2006.01)
Applicants: INTEL CORPORATION [US/US]; 2200 Mission College Boulevard M/S: RNB-4-150 Santa Clara, CA 95052 (US) (For All Designated States Except US).
NAGARAJAN, Sivakumar [IN/US]; (US) (For US Only).
RAZDAN, Sandeep [IN/US]; (US) (For US Only).
ANANTHAKRISHNAN, Nisha [US/US]; (US) (For US Only).
WEINMAN, Craig, J. [US/US]; (US) (For US Only).
MIRPURI, Kabirkumar, J. [CA/US]; (US) (For US Only)
Inventors: NAGARAJAN, Sivakumar; (US).
RAZDAN, Sandeep; (US).
ANANTHAKRISHNAN, Nisha; (US).
WEINMAN, Craig, J.; (US).
MIRPURI, Kabirkumar, J.; (US)
Agent: AIKIN, Jacob, T.; Blakely, Sokoloff, Taylor & Zafman LLP 1279 Oakmead Parkway Sunnyvale, CA 94085-4040 (US)
Priority Data:
Title (EN) FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED VIA THERMAL COMPRESSION BONDING PROCESS
(FR) MATIÈRE D'ENCAPSULATION DE FONDANT POUR DES CONDITIONNEMENTS MICROÉLECTRONIQUES ASSEMBLÉS PAR UN PROCÉDÉ DE LIAISON PAR COMPRESSION THERMIQUE
Abstract: front page image
(EN)A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250 °C - 300 °C at a ramp rate of 50 °C/second - 100 °C/second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150 - 1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5.
(FR)L'invention concerne une matière d'encapsulation de fondant et un procédé d'utilisation de celle-ci dans un procédé de liaison par compression thermique (TCB). Dans un mode de réalisation, le procédé TCB comprend la montée de la tête de liaison à 250°C - 300°C à une vitesse de montée de 50°C/seconde - 100°C/seconde. Dans un mode de réalisation, la matière d'encapsulation de fondant comprend une ou plusieurs résines époxy ayant un poids équivalent en époxy (EEW) de 150 - 1 000, un agent de durcissement et un fondant ayant un acide mono-carboxylique ou un acide di-carboxylique et un pKa de 4-5.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)