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1. (WO2013047474) SINTERED BODY, SINTERED BODY FOR THERMOELECTRIC CONVERSION ELEMENT, THERMOELECTRIC CONVERSION ELEMENT, AND THERMOELECTRIC CONVERSION MODULE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2013/047474    International Application No.:    PCT/JP2012/074479
Publication Date: 04.04.2013 International Filing Date: 25.09.2012
IPC:
C22C 29/18 (2006.01), B22F 3/10 (2006.01), C22C 1/04 (2006.01), C22C 1/05 (2006.01), H01L 35/14 (2006.01), H01L 35/34 (2006.01)
Applicants: TOKYO UNIVERSITY OF SCIENCE EDUCATIONAL FOUNDATION ADMINISTRATIVE ORGANIZATION [JP/JP]; 1-3, Kagurazaka, Shinjuku-ku, Tokyo 1628601 (JP) (For All Designated States Except US).
SHOWA KDE CO., LTD. [JP/JP]; 3-17-1, Akasaka, Minato-ku,, Tokyo 1070052 (JP) (For All Designated States Except US).
Toyota Tsusho Corporation [JP/JP]; 9-8, Meieki 4-chome, Nakamura-ku, Nagoya-shi, Aichi 4508575 (JP).
IIDA, Tsutomu [JP/JP]; (JP) (US only).
KOGO, Yasuo [JP/JP]; (JP) (US only).
SAKAMOTO, Tatsuya [JP/JP]; (JP) (US only).
KUROSAKI, Shota [JP/JP]; (JP) (US only).
HAYATSU, Yusuke [JP/JP]; (JP) (US only).
MITO, Yohiko [JP/JP]; (JP) (US only)
Inventors: IIDA, Tsutomu; (JP).
KOGO, Yasuo; (JP).
SAKAMOTO, Tatsuya; (JP).
KUROSAKI, Shota; (JP).
HAYATSU, Yusuke; (JP).
MITO, Yohiko; (JP)
Agent: SHOBAYASHI, Masayuki; Sapia Tower, 1-7-12, Marunouchi, Chiyoda-ku, Tokyo 1000005 (JP)
Priority Data:
2011-209769 26.09.2011 JP
Title (EN) SINTERED BODY, SINTERED BODY FOR THERMOELECTRIC CONVERSION ELEMENT, THERMOELECTRIC CONVERSION ELEMENT, AND THERMOELECTRIC CONVERSION MODULE
(FR) CORPS FRITTÉ, CORPS FRITTÉ POUR UN ÉLÉMENT DE CONVERSION THERMOÉLECTRIQUE, ÉLÉMENT DE CONVERSION THERMOÉLECTRIQUE ET MODULE DE CONVERSION THERMOÉLECTRIQUE
(JA) 焼結体、熱電変換素子用焼結体、熱電変換素子及び熱電変換モジュール
Abstract: front page image
(EN)Provided is technology whereby cracks, etc. are unlikely to occur in a sintered body of magnesium silicide, even if the size of the sintered body is larger than conventional sintered bodies. In this invention, a compound, alloy, or intermetallic compound, that includes at least one kind of metal from Ni, Zn, Al, Cu, Co, Ag, and Au, or an element of same, and has a fusion point of 419°-1,455°C is used as a binder metal, when spark plasma sintering a mixture of magnesium silicide and the binder metal or a mixture of a dopant-containing magnesium silicide and the binder metal.
(FR)La présente invention se rapporte à une technologie selon laquelle il est peu probable que des fissures, etc. apparaissent dans le corps fritté en siliciure de magnésium même si la taille du corps fritté est plus importante que celle des corps frittés classiques. Selon cette invention, un composé, un alliage ou un composé intermétallique qui comprend au moins un type de métal parmi le nickel (Ni), le zinc (Zn), l'aluminium (Al), le cuivre (Cu), le cobalt (Co), l'argent (Ag) et l'or (Au), ou un élément de ce dernier, et qui présente un point de fusion de 419° à 1 455°, est utilisé comme métal de liant lors d'un frittage par plasma à étincelles d'un mélange de siliciure de magnésium et du métal de liant ou d'un mélange d'un siliciure de magnésium contenant des dopants et du métal de liant.
(JA) マグネシウムシリサイドの焼結体のサイズを、従来のものより大きくしても焼結体にクラック等が発生し難くなる技術を提供する。 本発明では、マグネシウムシリサイドとバインダー金属との混合物、又はドーパントを含むマグネシウムシリサイドとバインダー金属との混合物を放電プラズマ焼結する際に、バインダー金属として、Ni、Zn、Al、Cu、Co、Ag、Auの少なくとも一種の金属、又はこれらの元素を含み、且つ、融点が419~1455℃である化合物、合金、若しくは金属間化合物を用いる。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)