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1. (WO2013047330) JOINT

Pub. No.:    WO/2013/047330    International Application No.:    PCT/JP2012/074103
Publication Date: Apr 4, 2013 International Filing Date: Sep 20, 2012
IPC: C04B 37/02
B23K 35/28
C22C 21/00
H01L 21/52
H01L 23/13
Applicants: NHK SPRING CO., LTD.
Inventors: SAITO, Shinji
斎藤 慎二
YAMAUCHI, Yuichiro
山内 雄一郎
Title: JOINT
Provided is a joint having a high joint strength and demonstrating excellent heat dissipation characteristics and heat resistance. The present invention comprises a semiconductor element (30) and an insulating ceramic substrate (10) on which is formed a circuit layer (20) to which the semiconductor element (30) is mounted. The semiconductor element (30) and the circuit layer (20) are bonded by brazing, in a vacuum or in an inert atmosphere, with an aluminum-based brazing filler (60) principally composed of aluminum and including at least one selected from the group consisting of germanium, magnesium, silicon, and copper.