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|1. (WO2013047330) JOINT|
|Applicants:||NHK SPRING CO., LTD.
Provided is a joint having a high joint strength and demonstrating excellent heat dissipation characteristics and heat resistance. The present invention comprises a semiconductor element (30) and an insulating ceramic substrate (10) on which is formed a circuit layer (20) to which the semiconductor element (30) is mounted. The semiconductor element (30) and the circuit layer (20) are bonded by brazing, in a vacuum or in an inert atmosphere, with an aluminum-based brazing filler (60) principally composed of aluminum and including at least one selected from the group consisting of germanium, magnesium, silicon, and copper.