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1. WO2013046675 - POWER CONVERTING APPARATUS

Publication Number WO/2013/046675
Publication Date 04.04.2013
International Application No. PCT/JP2012/006163
International Filing Date 26.09.2012
IPC
H01L 23/473 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
46involving the transfer of heat by flowing fluids
473by flowing liquids
H01L 25/07 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
07the devices being of a type provided for in group H01L29/78
H01L 25/18 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
CPC
H01L 23/4006
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
4006with bolts or screws
H01L 23/473
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
46involving the transfer of heat by flowing fluids
473by flowing liquids
H01L 25/162
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
16the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 ; and H01L51/00; , e.g. forming hybrid circuits
162the devices being mounted on two or more different substrates
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H05K 7/20927
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2089for power electronics, e.g. for inverters for controlling motor
20927Liquid coolant without phase change
Applicants
  • 富士電機株式会社 FUJI ELECTRIC CO.,LTD. [JP]/[JP]
Inventors
  • 田中 泰仁 TANAKA, Yasuhito
  • 柴田 美里 SHIBATA, Misato
Agents
  • 廣瀬 一 HIROSE, Hajime
Priority Data
2011-21181428.09.2011JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) POWER CONVERTING APPARATUS
(FR) APPAREIL DE TRANSFORMATION DE PUISSANCE
(JA) 電力変換装置
Abstract
(EN) Provided is a power converting apparatus which can efficiently dissipate heat of a heat generating circuit component mounted on a substrate to a cooling body without having a housing in a path for dissipating the heat of the heat generating circuit component. This power converting apparatus is provided with: a cooling body (3) having an open window (3g) at a part of a liquid flowing path (3c) in which a cooling liquid flows; and a semiconductor power module (11) wherein, on one surface of a case body (12) having therein a semiconductor switching element for power conversion, a cooling member (13) is formed, said cooling member having a liquid-contacting portion (13a) that is inserted into the open window of the cooling body, and closing the open window of the cooling body. The power converting apparatus is also provided with heat conductive supporting members (32, 33) which support, by keeping predetermined intervals to the semiconductor power module, mounting substrates (22, 23) having circuit components mounted therein, said circuit components including a heat generating circuit component for driving the semiconductor switching element, and which have a liquid-contacting portion (34a) inserted into the open window of the cooling body for the purpose of transferring heat of the mounting substrate to the cooling body.
(FR) L'invention concerne un appareil de transformation de puissance qui peut dissiper de manière efficace la chaleur d'un composant de circuit dégageant de la chaleur et monté sur un substrat, vers un corps de refroidissement, sans avoir un logement dans un trajet pour dissiper la chaleur du composant de circuit dégageant de la chaleur. Cet appareil de transformation de puissance comporte : un corps de refroidissement (3) ayant une fenêtre ouverte (3g) au niveau d'une partie d'un trajet d'écoulement de liquide (3c) dans lequel s'écoule un liquide de refroidissement; et un module de puissance à semi-conducteurs (11) dans lequel, sur une surface d'un corps de boîtier (12) ayant dans celui-ci un élément de commutation à semi-conducteurs pour transformation de puissance, est formé un élément de refroidissement (13), ledit élément de refroidissement ayant une partie de contact avec le liquide (13a) qui est introduite dans la fenêtre ouverte du corps de refroidissement, et fermant la fenêtre ouverte du corps de refroidissement. L'appareil de transformation de puissance comporte également des éléments de support conduisant la chaleur (32, 33) qui supportent, en maintenant des intervalles prédéterminés vis-à-vis du module de puissance à semi-conducteurs, des substrats de montage (22, 23) ayant des composants de circuit montés dans ceux-ci, lesdits composants de circuit comprenant un composant de circuit dégageant de la chaleur pour attaquer l'élément de commutation à semi-conducteurs, et qui ont une partie de contact avec le liquide (34a) introduite dans la fenêtre ouverte du corps de refroidissement afin de transférer la chaleur du substrat de montage vers le corps de refroidissement.
(JA)  基板に実装された発熱回路部品の熱の放熱経路に筐体を介在させることなく、発熱回路部品の熱を効率よく冷却体に放熱することができる電力変換装置を提供する。冷却液を通流する通液路(3c)の一部に開放窓(3g)を有する冷却体(3)と、電力変換用の半導体スイッチング素子を内蔵したケース体(12)の一面に、前記冷却体の開放窓内に挿通される接液部(13a)を有すると共に、前記冷却体の開放窓を閉塞する冷却部材(13)が形成された半導体パワーモジュール(11)とを備えている。また、前記半導体スイッチング素子を駆動する発熱回路部品を含む回路部品を実装した実装基板(22),(23)を前記半導体パワーモジュールとの間に所定間隔を保って支持し、当該実装基板の熱を前記冷却体に伝熱するため前記冷却体の開放窓内に挿通される接液部(34a)を有する伝熱支持部材(32),(33)を備えている。
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