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Pub. No.:    WO/2013/044838    International Application No.:    PCT/CN2012/082270
Publication Date: 04.04.2013 International Filing Date: 28.09.2012
H01L 23/495 (2006.01), H01L 23/48 (2006.01), H01L 23/12 (2006.01)
Applicants: MEDIATEK INC. [CN/CN]; No.1, Dusing Rd. 1st, Science-Based Industrial Park Hsin-Chu City, Taiwan (CN) (For All Designated States Except US).
CHEN, Nan-Jang [CN/CN]; (CN) (US only)
Inventors: CHEN, Nan-Jang; (CN)
Agent: BEIJING SANYOU INTELLECTUAL PROPERTY AGENCY LTD.; 16th Fl., Block A, Corporate Square No.35 Jinrong Street Beijing 100033 (CN)
Priority Data:
61/541,235 30.09.2011 US
13/626,899 26.09.2012 US
Abstract: front page image
(EN)A semiconductor package (10) includes a die pad (14), at least one semiconductor die (12a) mounted on the die pad (14), a plurality of leads (16) disposed along peripheral edges of the die pad (14), at least one connecting bar (142) for supporting the die pad (14), a first power bar (160a) disposed on one side of the connecting bar (142), a second power bar (160b) disposed on the other side of the connecting bar (142), and a connection member (28) traversing the connecting bar (142) and electrically connecting the first power bar (160a) with the second power bar (160b).
(FR)Le conditionnement semi-conducteur (10) selon l'invention comprend une pastille de puce (14), au moins une puce semi-conductrice (12a) montée sur la pastille de puce (14), une pluralité de conducteurs (16) disposés le long des arêtes périphériques de la puce semi-conductrice (14), au moins une barre connectrice (142) permettant de supporter la pastille de puce (14), une première barre de puissance (160a) disposée d'un côté de la barre connectrice (142), une seconde barre de puissance (160b) disposée de l'autre côté de la barre connectrice (142), et un organe de connexion (28) traversant la barre connectrice (142) et connectant électriquement la première barre de puissance (160a) à la seconde barre ce puissance (160b).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)