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1. WO2013012544 - SAW FILTER HAVING PLANAR BARRIER LAYER AND METHOD OF MAKING

Publication Number WO/2013/012544
Publication Date 24.01.2013
International Application No. PCT/US2012/044908
International Filing Date 29.06.2012
IPC
H03H 9/64 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
46Filters
64using surface acoustic waves
CPC
H03H 3/08
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
3Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
007for the manufacture of electromechanical resonators or networks
08for the manufacture of resonators or networks using surface acoustic waves
H03H 3/10
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
3Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
007for the manufacture of electromechanical resonators or networks
08for the manufacture of resonators or networks using surface acoustic waves
10for obtaining desired frequency or temperature coefficient
H03H 9/02834
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
02Details
02535of surface acoustic wave devices
02818Means for compensation or elimination of undesirable effects
02834of temperature influence
H03H 9/14538
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
02Details
125Driving means, e.g. electrodes, coils
145for networks using surface acoustic waves
14538Formation
H03H 9/14541
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
02Details
125Driving means, e.g. electrodes, coils
145for networks using surface acoustic waves
14538Formation
14541Multilayer finger or busbar electrode
Y10T 29/42
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
42Piezoelectric device making
Applicants
  • INTERNATIONAL BUSINESS MACHINES CORPORATION [US]/[US] (AllExceptUS)
  • ADKISSON, James, W. [US]/[US] (UsOnly)
  • CANDRA, Panglijen [ID]/[US] (UsOnly)
  • DUNBAR, Thomas, J. [US]/[US] (UsOnly)
  • GAMBINO, Jeffrey, P. [US]/[US] (UsOnly)
  • JAFFE, Mark, D. [US]/[US] (UsOnly)
  • STAMPER, Anthony, K. [US]/[US] (UsOnly)
  • WOLF, Randy, L. [US]/[US] (UsOnly)
Inventors
  • ADKISSON, James, W.
  • CANDRA, Panglijen
  • DUNBAR, Thomas, J.
  • GAMBINO, Jeffrey, P.
  • JAFFE, Mark, D.
  • STAMPER, Anthony, K.
  • WOLF, Randy, L.
Agents
  • KOTULAK, Richard, M.
Priority Data
13/183,97715.07.2011US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) SAW FILTER HAVING PLANAR BARRIER LAYER AND METHOD OF MAKING
(FR) FILTRE SAW AYANT UNE COUCHE DE BARRIÈRE PLANE ET PROCÉDÉ DE FABRICATION ASSOCIÉ
Abstract
(EN)
Disclosed herein is a surface acoustic wave (SAW) filter and method of making the same. The SAW filter includes a piezoelectric substrate (110; Fig 3); a planar barrier layer (120) disposed above the piezoelectric substrate, and at least one conductor buried (130) in the piezoelectric substrate and the planar barrier layer.
(FR)
L'invention porte sur un filtre à onde acoustique de surface (SAW) et un procédé de réalisation de celui-ci. Le filtre SAW comprend un substrat piézoélectrique (110 ; Figure 3) ; une couche de barrière plane (120) disposée au-dessus du substrat piézoélectrique ; et au moins un conducteur enterré (130) dans le substrat piézoélectrique et la couche de barrière plane.
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