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1. WO2013011594 - CIRCUIT BOARD FOR HAVING SEMICONDUCTOR LIGHT EMITTING DEVICE MOUNTED THEREON, LIGHT EMITTING MODULE, ILLUMINATING APPARATUS, AND ILLUMINATING SYSTEM

Publication Number WO/2013/011594
Publication Date 24.01.2013
International Application No. PCT/JP2011/069739
International Filing Date 31.08.2011
IPC
H01L 33/64 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
64Heat extraction or cooling elements
F21V 29/00 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
F21Y 101/02 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V124
101Point-like light sources
02Miniature, e.g. light emitting diodes (LED)
CPC
F21K 9/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
9Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
F21V 29/70
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
50Cooling arrangements
70characterised by passive heat-dissipating elements, e.g. heat-sinks
F21V 29/773
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
50Cooling arrangements
70characterised by passive heat-dissipating elements, e.g. heat-sinks
74with fins or blades
77with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
773the planes containing the fins or blades having the direction of the light emitting axis
F21V 29/85
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
85characterised by the material
F21V 5/007
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
5Refractors for light sources
007Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
F21V 5/04
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
5Refractors for light sources
04of lens shape
Applicants
  • 三菱化学株式会社 MITSUBISHI CHEMICAL CORPORATION [JP]/[JP] (AllExceptUS)
  • 笠倉 暁夫 KASAKURA, Akeo (UsOnly)
  • 大中 修治 ONAKA, Shuuji (UsOnly)
  • 武田 立 TAKEDA, Toru (UsOnly)
  • 佐藤 義人 SATOU, Yoshihito (UsOnly)
Inventors
  • 笠倉 暁夫 KASAKURA, Akeo
  • 大中 修治 ONAKA, Shuuji
  • 武田 立 TAKEDA, Toru
  • 佐藤 義人 SATOU, Yoshihito
Agents
  • 川口 嘉之 KAWAGUCHI, Yoshiyuki
Priority Data
2011-15703815.07.2011JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CIRCUIT BOARD FOR HAVING SEMICONDUCTOR LIGHT EMITTING DEVICE MOUNTED THEREON, LIGHT EMITTING MODULE, ILLUMINATING APPARATUS, AND ILLUMINATING SYSTEM
(FR) CARTE DE CIRCUITS IMPRIMÉS DESTINÉE À RECEVOIR UN DISPOSITIF SEMI-CONDUCTEUR ÉLECTROLUMINESCENT, MODULE ÉLECTROLUMINESCENT, APPAREIL D'ÉCLAIRAGE ET SYSTÈME D'ÉCLAIRAGE
(JA) 半導体発光装置を搭載するための回路基板、発光モジュール、照明器具、及び照明システム
Abstract
(EN)
Provided is a technology relating to improvement of dissipation performance of heat generated in a semiconductor light emitting device. This light emitting module includes a circuit board, and a semiconductor light emitting device that is provided with at least a semiconductor light emitting element and a fluorescent material. On the circuit board, a semiconductor light emitting device, which has a plurality of semiconductor light emitting elements respectively having different paths through which drive currents are supplied, and/or a plurality of semiconductor light emitting devices respectively having different paths through which drive currents are supplied to semiconductor light emitting elements are mounted. The circuit board is provided with: a base material portion, which is formed using a heat conducting material; and a power supply conductor layer, which supplies the drive currents of the semiconductor light emitting elements to the semiconductor light emitting device(s). The power supply conductor layer is planarly formed using a heat conducting material such that the power supply conductor layer covers a base material flat surface, and a flat surface region of the power supply conductor layer is planarly partitioned by each drive current path by means of an insulator.
(FR)
L'invention concerne une technologie intéressant une amélioration des performances de dissipation de la chaleur produite dans un dispositif semi-conducteur électroluminescent. Ce module électroluminescent comprend une carte de circuits imprimés et un dispositif semi-conducteur électroluminescent qui comprend au moins un élément semi-conducteur électroluminescent et un matériau fluorescent. Sur la carte de circuits imprimés, sont montés un dispositif semi-conducteur électroluminescent, qui comprend une pluralité d'éléments semi-conducteurs électroluminescents ayant respectivement des trajets différents par lesquels sont fournis des courants d'attaque, et/ou une pluralité de dispositifs semi-conducteurs électroluminescents ayant différents trajets par lesquels des courants d'attaque sont fournis aux éléments semi-conducteurs électroluminescents. La carte de circuits imprimés comprend : une partie de matériau de base, formée d'un matériau thermoconducteur; et une couche électroconductrice qui fournit les courants d'attaque des éléments semi-conducteurs électroluminescents aux dispositifs semi-conducteurs électroluminescents. La couche électroconductrice est produite de manière planaire à l'aide d'un matériau thermoconducteur, si bien que la couche électroconductrice recouvre une surface plane du matériau de base et la région superficielle plane de la couche électroconductrice est partagée de manière plane par chaque trajet de courant d'attaque à l'aide d'un isolant.
(JA)
 半導体発光装置において発生した熱の放熱性能の向上に関する技術を提供する。少なくとも半導体発光素子及び蛍光体を備える半導体発光装置と、回路基板とを含む発光モジュールにおいて、回路基板には少なくとも、供給される駆動電流の経路が異なる複数の半導体発光素子を有する半導体発光装置が搭載されるか、若しくは半導体発光素子に供給する駆動電流の経路が異なる複数の半導体発光装置が搭載される。回路基板は、熱伝導材料を用いて形成された基材部と、半導体発光素子の駆動電流を半導体発光装置に供給する電力供給導体層と、を備える。電力供給導体層は、熱伝導材料を用いて且つ基材部平面を覆うように面状に形成され、且つ、その平面領域が駆動電流の経路毎に絶縁体によって平面的に区画される。
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